
AMD Xilinx
XCV50-4TQG144I
XCV50-4TQG144I ECAD Model
XCV50-4TQG144I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Equivalent Gates | 57906 | |
Number of CLBs | 384 | |
Combinatorial Delay of a CLB-Max | 800 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 384 CLBS, 57906 GATES | |
Clock Frequency-Max | 250 MHz | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PQFP-G144 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 144 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFQFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Pitch | 500 µm | |
Terminal Position | QUAD | |
Width | 20 mm | |
Length | 20 mm | |
Seated Height-Max | 1.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | QFP | |
Package Description | LFQFP, | |
Pin Count | 144 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCV50-4TQG144I Datasheet Download
XCV50-4TQG144I Overview
The chip model XCV50-4TQG144I is a high-performance, low-power chip solution for the next generation of network and system applications. It is designed with advanced technologies such as multi-core architecture, high-speed memory, and high-speed interconnects, making it a powerful and versatile solution for a wide range of applications.
It is an ideal solution for the next generation of networks and systems due to its low power consumption and high performance. It is capable of handling large amounts of data and providing efficient communication between devices. It is also suitable for intelligent scenarios, such as machine learning and artificial intelligence.
The chip model XCV50-4TQG144I is expected to be a major player in the future of the industry. It is expected to be used in a wide range of applications, including networking, data centers, and intelligent systems. Its advanced features and capabilities make it a powerful and versatile solution for a variety of scenarios.
In the era of fully intelligent systems, the chip model XCV50-4TQG144I may be used to enable the development of more intelligent applications. It is capable of providing efficient communication between devices, and its advanced features make it suitable for machine learning and artificial intelligence. It is also capable of handling large amounts of data, making it an ideal solution for data centers.
The chip model XCV50-4TQG144I is expected to be in high demand in the future, as it provides a powerful and versatile solution for a wide range of applications. Its low power consumption, high performance, and advanced features make it an ideal solution for the next generation of networks and systems. It is also capable of being used in intelligent scenarios, such as machine learning and artificial intelligence, making it a great choice for the era of fully intelligent systems.
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