AMD Xilinx
XCV50-4FGG256I
XCV50-4FGG256I ECAD Model
XCV50-4FGG256I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 57906 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 800 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 57906 GATES | |
| Clock Frequency-Max | 250 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV50-4FGG256I Datasheet Download
XCV50-4FGG256I Overview
The chip model XCV50-4FGG256I is a powerful and versatile processor designed for high-performance digital signal processing, embedded processing, and image processing. This model is capable of meeting the needs of a wide range of applications, from consumer electronics to industrial automation. It is designed for use in a variety of environments, including those where the use of HDL language is required.
The XCV50-4FGG256I is an ideal choice for industries that require high-performance digital signal processing, embedded processing, and image processing. This chip model offers a number of advantages, including a high clock speed, low power consumption, and robust memory management. It is also designed to support a wide range of operating systems, including Linux, Windows, and Mac OS. This makes it an ideal choice for applications that require a high degree of compatibility and flexibility.
The XCV50-4FGG256I is also designed to be compatible with a range of new technologies, including artificial intelligence and machine learning. This makes it well-suited for use in applications such as autonomous vehicles and robotics, where the need for high performance is paramount. Additionally, this chip model is designed to be future-proof, meaning it can easily be adapted to meet the demands of new technologies and applications as they emerge.
The XCV50-4FGG256I is expected to become increasingly popular in the coming years. This is due to its combination of high performance, low power consumption, and compatibility with a range of new technologies. Additionally, its flexibility and future-proof design make it an ideal choice for a wide range of applications. As such, it is expected that the demand for this chip model will continue to grow in the years to come.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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