AMD Xilinx
XCV50-4FGG256C
XCV50-4FGG256C ECAD Model
XCV50-4FGG256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 57906 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 800 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 57906 GATES | |
| Clock Frequency-Max | 250 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV50-4FGG256C Datasheet Download
XCV50-4FGG256C Overview
The XCV50-4FGG256C chip model is a powerful and versatile model designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing. It is a significant advancement in the field of chip technology and provides users with the ability to develop complex applications with ease.
The XCV50-4FGG256C chip model is designed to be used with a hardware description language (HDL) and offers a wide range of features and benefits. The model features a high-performance processor that can handle complex tasks with ease and is capable of supporting multiple data types. Additionally, the model is equipped with a large memory capacity, providing users with the ability to store large amounts of data.
The XCV50-4FGG256C chip model also offers a wide range of communication options, making it suitable for use in a variety of applications. This includes support for advanced communication systems, such as Ethernet, Wi-Fi, and Bluetooth. Additionally, the model also provides support for advanced encryption protocols, such as AES and RSA.
The XCV50-4FGG256C model is designed to be used in a variety of industries, including automotive, medical, and industrial applications. This makes it a highly sought after model for many different applications. As the demand for these types of applications increases, the demand for the XCV50-4FGG256C chip model is expected to grow.
The original design intention of the XCV50-4FGG256C chip model was to provide users with a powerful and versatile platform that could be used in a variety of applications. The model was designed to be flexible, allowing users to customize it to meet their specific needs. Additionally, the model was designed with the possibility of future upgrades in mind, making it a great choice for those looking to take advantage of new technologies as they become available.
The XCV50-4FGG256C chip model is a powerful and versatile model that can be used in a variety of applications. It is designed to be used with a hardware description language (HDL) and offers a wide range of features and benefits. Additionally, the model is capable of supporting advanced communication systems, making it suitable for use in a variety of industries. With the possibility of future upgrades, the XCV50-4FGG256C chip model is sure to remain a popular choice for users looking for a powerful and versatile platform.
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