AMD Xilinx
XCV50-4CSG144I
XCV50-4CSG144I ECAD Model
XCV50-4CSG144I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 57906 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 800 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 57906 GATES | |
| Clock Frequency-Max | 250 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 12 mm | |
| Length | 12 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | TFBGA, | |
| Pin Count | 144 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV50-4CSG144I Datasheet Download
XCV50-4CSG144I Overview
The XCV50-4CSG144I is a powerful chip model designed to provide high-performance digital signal processing, embedded processing, and image processing. It is programmed using the HDL language, and its original design intention was to create a versatile chip that could be used in a variety of applications. This chip model has the potential to be used in advanced communication systems, networks, and intelligent scenarios.
The XCV50-4CSG144I is capable of providing high-speed data processing, making it ideal for communication systems. It can be used to process large amounts of data quickly and accurately, making it a great choice for networks that need to transmit large amounts of information quickly. Additionally, it can also be used to process images and videos, making it a great choice for image and video processing applications.
The XCV50-4CSG144I is also capable of being upgraded in the future. This means that it can be used in more advanced applications as technology progresses. It can be used in the era of fully intelligent systems, as it can process data quickly and accurately. This chip model is also capable of being used in intelligent scenarios, such as in autonomous vehicles, robotics, and machine learning applications.
Overall, the XCV50-4CSG144I is a powerful chip model that is capable of providing high-performance digital signal processing, embedded processing, and image processing. It is programmed using the HDL language and is capable of being upgraded in the future. It can be used in advanced communication systems, networks, and intelligent scenarios, making it a great choice for a variety of applications.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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