AMD Xilinx
XCV50-4CSG144C
XCV50-4CSG144C ECAD Model
XCV50-4CSG144C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 57906 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 800 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 57906 GATES | |
| Clock Frequency-Max | 250 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 12 mm | |
| Length | 12 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | TFBGA, | |
| Pin Count | 144 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV50-4CSG144C Datasheet Download
XCV50-4CSG144C Overview
The XCV50-4CSG144C chip model is a cutting-edge technology designed to meet the needs of modern communication systems. It is a four-layer, 0.5-micron CMOS chip with a core voltage of 1.8V and a wide range of I/O voltage levels. The model is designed with an advanced system-on-chip (SoC) architecture, which is capable of supporting a variety of communication protocols, including Wi-Fi, Bluetooth, and Ethernet.
The XCV50-4CSG144C chip model is intended to be used in applications that require high-speed data transfer and communication. It is designed to provide a reliable, low-power solution for a variety of communication systems. The model is also capable of supporting a wide range of protocols, allowing it to be used in a variety of applications.
The XCV50-4CSG144C chip model is designed to be upgradeable, allowing for future upgrades and modifications. This allows the model to be used in a variety of applications, including advanced communication systems. The model is also capable of supporting a wide range of protocols, allowing for a variety of communication applications.
The XCV50-4CSG144C chip model is also capable of being used in the development and popularization of future intelligent robots. This is due to its ability to support a wide range of protocols, allowing for communication between robots and other devices. The model is also capable of supporting a variety of communication protocols, allowing for communication between robots and other devices.
In order to use the XCV50-4CSG144C chip model effectively, certain technical talents are required. This includes knowledge of communication protocols and a basic understanding of the architecture of the model. Additionally, knowledge of the programming language and operating system used by the model is also required.
In conclusion, the XCV50-4CSG144C chip model is a cutting-edge technology designed to meet the needs of modern communication systems. It is designed to provide a reliable, low-power solution for a variety of communication systems and is upgradeable, allowing for future upgrades and modifications. The model is also capable of being used in the development and popularization of future intelligent robots. In order to use the XCV50-4CSG144C chip model effectively, certain technical talents are required, including knowledge of communication protocols and a basic understanding of the architecture of the model.
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