AMD Xilinx
XCV50-4CS144C
XCV50-4CS144C ECAD Model
XCV50-4CS144C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 94 | |
| Number of Outputs | 94 | |
| Number of Logic Cells | 1728 | |
| Number of Equivalent Gates | 57906 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 800 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 57906 GATES | |
| Clock Frequency-Max | 250 MHz | |
| Power Supplies | 1.2/3.6,2.5 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA144,13X13,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 12 mm | |
| Length | 12 mm | |
| Seated Height-Max | 1.2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | CSP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCV50-4CS144C Datasheet Download
XCV50-4CS144C Overview
The chip model XCV50-4CS144C is a high-performance device designed for digital signal processing, embedded processing, and image processing applications. It is developed using the HDL language, providing a powerful platform for users to create custom solutions. Its advantages include high computing power, low power consumption, and flexibility.
The XCV50-4CS144C chip model has been widely used in a variety of industries since its introduction. In particular, it is ideal for high-performance digital signal processing, embedded processing, and image processing applications. With the increasing demand for high-performance solutions, the demand for the chip model is expected to increase in the future.
The original design intention of the XCV50-4CS144C was to provide users with a powerful device for custom solutions. It is capable of processing complex data quickly and efficiently, and its low power consumption makes it an attractive option for a variety of applications. Additionally, the chip model is designed with the possibility of future upgrades, allowing users to take advantage of new technologies as they become available.
The XCV50-4CS144C chip model is also suitable for advanced communication systems. It has the necessary features for the efficient transmission and reception of data, and its high computing power ensures that the system can handle large amounts of data. Furthermore, its flexibility allows users to customize the system according to their needs.
In conclusion, the XCV50-4CS144C chip model is an excellent choice for high-performance digital signal processing, embedded processing, image processing, and advanced communication systems. Its advantages, including high computing power, low power consumption, and flexibility, make it an attractive option for a variety of applications. The chip model is also designed with the possibility of future upgrades, allowing users to take advantage of new technologies as they become available.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $61.6001 | $61.6001 |
| 10+ | $60.9378 | $609.3776 |
| 100+ | $57.6259 | $5,762.5929 |
| 1000+ | $54.3141 | $27,157.0470 |
| 10000+ | $49.6775 | $49,677.5250 |
| The price is for reference only, please refer to the actual quotation! | ||