XCV405E-8FGG676C
XCV405E-8FGG676C
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XCV405E-8FGG676C


XCV405E-8FGG676C
F20-XCV405E-8FGG676C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA
BGA

XCV405E-8FGG676C ECAD Model


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XCV405E-8FGG676C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Equivalent Gates 129600
Number of CLBs 2400
Combinatorial Delay of a CLB-Max 400 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 2400 CLBS, 129600 GATES
Clock Frequency-Max 416 MHz
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B676
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA,
Pin Count 676
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCV405E-8FGG676C Datasheet Download


XCV405E-8FGG676C Overview



The chip model XCV405E-8FGG676C is an integrated circuit that is designed to support a variety of applications. It features a wide range of features and functions, including low power consumption, high performance, and high integration. This chip model is designed to be used in a wide range of applications, such as automotive, consumer electronics, industrial, and medical.


The chip model XCV405E-8FGG676C has many advantages over other chip models. It has a low power consumption, which means it can be used in a wide range of applications without needing to worry about power consumption. It also has a high performance, which makes it suitable for applications that require a high degree of accuracy and speed. Additionally, the chip model has a high integration, meaning that it can be used in a wide range of applications without needing to worry about compatibility issues.


In terms of industry trends, the chip model XCV405E-8FGG676C is expected to be in high demand in the future. This is due to the fact that the chip model is designed to be used in a wide range of applications, such as automotive, consumer electronics, industrial, and medical. As the demand for these applications increases, the demand for the chip model XCV405E-8FGG676C is expected to increase as well.


When it comes to the product description and specific design requirements of the chip model XCV405E-8FGG676C, it is important to note that the chip model is designed to be used in a wide range of applications. This means that the chip model should be able to support a variety of technologies, such as Bluetooth, Wi-Fi, and ZigBee. Additionally, the chip model should also be able to support a variety of data formats, such as JPEG, MP3, and MPEG.


When it comes to actual case studies and precautions, it is important to note that the chip model XCV405E-8FGG676C should be used with caution. This is because the chip model is designed to be used in a wide range of applications, which means that it should be used in the proper environment. Additionally, the chip model should be tested thoroughly before it is used in an application. This is to ensure that the chip model is working correctly and is not causing any problems.


Overall, the chip model XCV405E-8FGG676C is an integrated circuit that is designed to support a variety of applications. It features a wide range of features and functions, including low power consumption, high performance, and high integration. This chip model is designed to be used in a wide range of applications, such as automotive, consumer electronics, industrial, and medical. The chip model is expected to be in high demand in the future, and it is important to note that the chip model should be used with caution in the proper environment. Additionally, the chip model should be tested thoroughly before it is used in an application.



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Unit Price: $490.9212
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QTY Unit Price Ext Price
1+ $456.5567 $456.5567
10+ $451.6475 $4,516.4750
100+ $427.1014 $42,710.1444
1000+ $402.5554 $201,277.6920
10000+ $368.1909 $368,190.9000
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