
AMD Xilinx
XCV405E-8FGG676C
XCV405E-8FGG676C ECAD Model
XCV405E-8FGG676C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Equivalent Gates | 129600 | |
Number of CLBs | 2400 | |
Combinatorial Delay of a CLB-Max | 400 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 2400 CLBS, 129600 GATES | |
Clock Frequency-Max | 416 MHz | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B676 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 676 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, | |
Pin Count | 676 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCV405E-8FGG676C Datasheet Download
XCV405E-8FGG676C Overview
The chip model XCV405E-8FGG676C is an integrated circuit that is designed to support a variety of applications. It features a wide range of features and functions, including low power consumption, high performance, and high integration. This chip model is designed to be used in a wide range of applications, such as automotive, consumer electronics, industrial, and medical.
The chip model XCV405E-8FGG676C has many advantages over other chip models. It has a low power consumption, which means it can be used in a wide range of applications without needing to worry about power consumption. It also has a high performance, which makes it suitable for applications that require a high degree of accuracy and speed. Additionally, the chip model has a high integration, meaning that it can be used in a wide range of applications without needing to worry about compatibility issues.
In terms of industry trends, the chip model XCV405E-8FGG676C is expected to be in high demand in the future. This is due to the fact that the chip model is designed to be used in a wide range of applications, such as automotive, consumer electronics, industrial, and medical. As the demand for these applications increases, the demand for the chip model XCV405E-8FGG676C is expected to increase as well.
When it comes to the product description and specific design requirements of the chip model XCV405E-8FGG676C, it is important to note that the chip model is designed to be used in a wide range of applications. This means that the chip model should be able to support a variety of technologies, such as Bluetooth, Wi-Fi, and ZigBee. Additionally, the chip model should also be able to support a variety of data formats, such as JPEG, MP3, and MPEG.
When it comes to actual case studies and precautions, it is important to note that the chip model XCV405E-8FGG676C should be used with caution. This is because the chip model is designed to be used in a wide range of applications, which means that it should be used in the proper environment. Additionally, the chip model should be tested thoroughly before it is used in an application. This is to ensure that the chip model is working correctly and is not causing any problems.
Overall, the chip model XCV405E-8FGG676C is an integrated circuit that is designed to support a variety of applications. It features a wide range of features and functions, including low power consumption, high performance, and high integration. This chip model is designed to be used in a wide range of applications, such as automotive, consumer electronics, industrial, and medical. The chip model is expected to be in high demand in the future, and it is important to note that the chip model should be used with caution in the proper environment. Additionally, the chip model should be tested thoroughly before it is used in an application.
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Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $456.5567 | $456.5567 |
10+ | $451.6475 | $4,516.4750 |
100+ | $427.1014 | $42,710.1444 |
1000+ | $402.5554 | $201,277.6920 |
10000+ | $368.1909 | $368,190.9000 |
The price is for reference only, please refer to the actual quotation! |