AMD Xilinx
XCV405E-8BGG560C
XCV405E-8BGG560C ECAD Model
XCV405E-8BGG560C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Equivalent Gates | 129600 | |
| Number of CLBs | 2400 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2400 CLBS, 129600 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 560 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XCV405E-8BGG560C Datasheet Download
XCV405E-8BGG560C Overview
The XCV405E-8BGG560C is a high-performance chip model designed for digital signal processing, embedded processing, and image processing. It is designed to provide users with an effective solution for complex digital signal processing and embedded processing tasks. The XCV405E-8BGG560C utilizes the HDL (Hardware Description Language) for its programming and design, allowing for a more efficient and reliable development process.
The original design intention of the XCV405E-8BGG560C was to provide users with a reliable and powerful solution for their digital signal processing and embedded processing needs. It has been designed with future upgrades in mind, allowing users to take advantage of the latest technologies and features. The XCV405E-8BGG560C can also be applied to advanced communication systems, providing users with a robust and reliable solution for their communication needs.
The product description and design requirements of the XCV405E-8BGG560C are available on the official website. It contains detailed specifications, including the processor architecture, memory, and communication interfaces. The design requirements are also provided, which include the instruction set, the HDL language, and the power consumption. Additionally, the website provides actual case studies and precautions to help users get the most out of the XCV405E-8BGG560C.
In conclusion, the XCV405E-8BGG560C is a powerful and reliable chip model designed for digital signal processing, embedded processing, and image processing. It utilizes the HDL language for programming and design, and is designed to be upgradeable for future use. It can also be applied to advanced communication systems, providing users with a robust and reliable solution for their communication needs. The product description and design requirements are available on the official website, along with actual case studies and precautions to help users get the most out of the XCV405E-8BGG560C.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||