AMD Xilinx
XCV405E-8BG560I
XCV405E-8BG560I ECAD Model
XCV405E-8BG560I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 404 | |
| Number of Outputs | 404 | |
| Number of Logic Cells | 10800 | |
| Number of Equivalent Gates | 129600 | |
| Number of CLBs | 2400 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2400 CLBS, 129600 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA560,33X33,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-560 | |
| Pin Count | 560 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCV405E-8BG560I Datasheet Download
XCV405E-8BG560I Overview
The XCV405E-8BG560I chip model is a powerful tool for high-performance digital signal processing, embedded processing, image processing, and other related applications. This chip model requires the use of HDL language, which is a hardware description language used to create computer hardware designs. It is a powerful language that allows users to create complex hardware designs that can be used in a variety of applications.
The XCV405E-8BG560I chip model offers a number of advantages over other chip models. It has a high clock speed, a low power consumption, and a high level of integration. This makes it an ideal choice for applications that require a high level of performance and reliability. Additionally, the chip model is designed to be compatible with a variety of operating systems, making it an ideal choice for a wide range of applications.
The demand for the XCV405E-8BG560I chip model is expected to grow in the future, as more applications require a high level of performance and reliability. As networks become more complex and intelligent systems are developed, the need for high-performance chips will only increase. The XCV405E-8BG560I chip model is well-suited for these applications, as it is designed to be compatible with a variety of operating systems and can be used to create complex hardware designs.
The XCV405E-8BG560I chip model is also well-suited for use in networks and intelligent scenarios. As networks become more complex, the need for high-performance chips will only increase. The XCV405E-8BG560I chip model is designed to be compatible with a variety of operating systems and can be used to create complex hardware designs. Additionally, the chip model is designed to be compatible with intelligent systems, making it an ideal choice for applications that require a high level of performance and reliability.
The XCV405E-8BG560I chip model is also well-suited for use in the era of fully intelligent systems. As intelligent systems become more complex, the need for high-performance chips will only increase. The XCV405E-8BG560I chip model is designed to be compatible with a variety of operating systems and can be used to create complex hardware designs. Additionally, the chip model is designed to be compatible with intelligent systems, making it an ideal choice for applications that require a high level of performance and reliability.
In conclusion, the XCV405E-8BG560I chip model is an ideal choice for high-performance digital signal processing, embedded processing, image processing, and other related applications. It has a high clock speed, a low power consumption, and a high level of integration, making it an ideal choice for applications that require a high level of performance and reliability. Additionally, the chip model is designed to be compatible with a variety of operating systems and can be used to create complex hardware designs. The chip model is also well-suited for use in networks and intelligent scenarios, as well as for use in the era of fully intelligent systems. As such, the demand for this chip model is expected to grow in the future.
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