AMD Xilinx
XCV405E-7FGG676C
XCV405E-7FGG676C ECAD Model
XCV405E-7FGG676C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Equivalent Gates | 129600 | |
| Number of CLBs | 2400 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2400 CLBS, 129600 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 676 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV405E-7FGG676C Datasheet Download
XCV405E-7FGG676C Overview
Chip model XCV405E-7FGG676C is a new type of advanced chip model that has been developed by a leading chip manufacturer. It is designed to provide superior performance, reliability, and cost-effectiveness for a wide range of applications. This new model is capable of processing large amounts of data quickly and reliably. It is also designed to be energy-efficient, making it suitable for use in a variety of industries.
The XCV405E-7FGG676C chip model is equipped with a powerful processor, which can process up to 8 billion instructions per second. It also features a powerful memory system, which can store up to 4GB of data. In addition, the model has a wide range of connectivity options, such as USB, Ethernet, and Wi-Fi. This makes it suitable for a range of different applications.
The XCV405E-7FGG676C chip model has a number of advantages over other models. For example, it is capable of executing complex algorithms quickly and accurately. It also has a low power consumption, which makes it suitable for use in a variety of industries. Furthermore, the model is designed to be highly reliable, which means that it can be used in a wide range of applications without fear of failure.
The XCV405E-7FGG676C chip model is expected to be in high demand in the near future. This is due to its superior performance, reliability, and cost-effectiveness. It is also expected to be used in a variety of industries, from automotive to medical. Additionally, the model is expected to be used in the development and popularization of future intelligent robots.
In order to use the XCV405E-7FGG676C chip model effectively, certain technical skills and knowledge are required. For example, it is important to understand the architecture of the chip and the different components that make it up. Additionally, one must understand how the chip works in order to effectively program it. Furthermore, knowledge of software engineering, computer architecture, and electrical engineering is essential.
In conclusion, the XCV405E-7FGG676C chip model is an advanced and reliable chip model that is expected to be in high demand in the near future. It is capable of executing complex algorithms quickly and accurately, making it suitable for a range of different industries. Additionally, the model is expected to be used in the development and popularization of future intelligent robots. In order to use the model effectively, certain technical skills and knowledge are required.
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