AMD Xilinx
XCV405E-6BGG560I
XCV405E-6BGG560I ECAD Model
XCV405E-6BGG560I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Equivalent Gates | 129600 | |
| Number of CLBs | 2400 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2400 CLBS, 129600 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 560 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV405E-6BGG560I Datasheet Download
XCV405E-6BGG560I Overview
The chip model XCV405E-6BGG560I has been gaining increasing attention in the semiconductor industry in recent years. As a new generation of chips, it has been widely adopted in various fields, such as networks, intelligent scenarios, and robots. It is expected to play an important role in the development and popularization of future intelligent systems.
The chip model XCV405E-6BGG560I is equipped with advanced features and technologies that make it suitable for a wide range of applications. It is designed to be highly efficient and reliable, and it can be used in networks, intelligent scenarios, and robots. It is also capable of supporting new technologies, making it a powerful tool for the development and popularization of future intelligent systems.
In terms of industry trends, the chip model XCV405E-6BGG560I is expected to be widely adopted in the future. It is expected to be used in a variety of applications, such as networks, intelligent scenarios, and robots. It is also expected to be used in the era of fully intelligent systems, where it will be used to power a variety of devices.
In order to effectively use the chip model XCV405E-6BGG560I, technical talents are needed. These technical talents should have a good understanding of the chip model, as well as its features and technologies. They should also have a good understanding of the application environment, and the technologies that are required to support the chip model.
In conclusion, the chip model XCV405E-6BGG560I is expected to be widely adopted in the future. It is expected to be used in networks, intelligent scenarios, and robots, and it is also expected to be used in the era of fully intelligent systems. In order to effectively use the chip model, technical talents are needed to understand its features and technologies, as well as the application environment and the technologies that are required to support the chip model.
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