AMD Xilinx
XCV405E-6BGG560C
XCV405E-6BGG560C ECAD Model
XCV405E-6BGG560C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Equivalent Gates | 129600 | |
| Number of CLBs | 2400 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2400 CLBS, 129600 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 560 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XCV405E-6BGG560C Datasheet Download
XCV405E-6BGG560C Overview
The chip model XCV405E-6BGG560C is a highly advanced integrated circuit that is designed to meet the needs of a wide range of applications. It is a high-performance, low-power, and cost-effective solution for many industrial applications. The chip model is manufactured by a leading semiconductor company and is based on the latest technology.
The XCV405E-6BGG560C is a versatile chip that offers excellent performance in a wide range of applications. It is designed to provide reliable communication and data processing capabilities for industrial applications. It supports a variety of communication protocols and can be used for various applications such as machine control, data acquisition, and industrial automation.
The chip model offers a wide range of features and benefits. It is designed to be highly efficient, with low power consumption, and can be used in a variety of industrial applications. The chip model also offers a wide range of communication protocols, including Ethernet, RS-232, and USB, and can be used for different applications such as machine control, data acquisition, and industrial automation.
The XCV405E-6BGG560C is designed to be highly reliable and robust, with a wide range of features and benefits. It is designed to provide reliable communication and data processing capabilities for industrial applications. It also offers a wide range of communication protocols, including Ethernet, RS-232, and USB. The chip model is also designed to be highly efficient, with low power consumption, and can be used in a variety of industrial applications.
The chip model is designed to meet the needs of a wide range of applications and is expected to have a strong demand in the future. It is designed to provide reliable communication and data processing capabilities for industrial applications. It also offers a wide range of communication protocols, including Ethernet, RS-232, and USB. The chip model is also designed to be highly efficient, with low power consumption, and can be used in a variety of industrial applications.
The product description and design requirements of the XCV405E-6BGG560C are available on the manufacturer's website. The product description includes the features and benefits of the chip model, as well as the design requirements. The design requirements include the power supply voltage range, the operating temperature range, the operating frequency range, and the communication protocol requirements.
In addition to the product description and design requirements, actual case studies and precautions should also be taken into consideration when using the XCV405E-6BGG560C. Actual case studies can provide valuable insight into the performance of the chip model in different applications. Precautions should be taken to ensure that the chip model is used in the correct environment and is not exposed to any environmental hazards that could affect its performance.
In conclusion, the chip model XCV405E-6BGG560C is a highly advanced integrated circuit that is designed to meet the needs of a wide range of applications. It is a high-performance, low-power, and cost-effective solution for many industrial applications. It is designed to provide reliable communication and data processing capabilities for industrial applications and is expected to have a strong demand in the future. The product description and design requirements of the XCV405E-6BGG560C are available on the manufacturer's website, as well as actual case studies and precautions. Whether the application environment requires the support of new technologies or not depends on what specific technologies are needed.
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