AMD Xilinx
XCV400E-8BGG432I
XCV400E-8BGG432I ECAD Model
XCV400E-8BGG432I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 316 | |
| Number of Outputs | 316 | |
| Number of Logic Cells | 10800 | |
| Number of Equivalent Gates | 129600 | |
| Number of CLBs | 2400 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2400 CLBS, 129600 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B432 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 432 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA432,31X31,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, BGA432,31X31,50 | |
| Pin Count | 432 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV400E-8BGG432I Datasheet Download
XCV400E-8BGG432I Overview
The chip model XCV400E-8BGG432I is an advanced integrated circuit (IC) developed by a leading semiconductor manufacturer. It is designed to meet the growing demand for high-performance, low-power, and low-cost ICs. This chip model is the latest in a series of advanced ICs developed by the company and is designed to provide superior performance in a variety of applications.
The XCV400E-8BGG432I chip model is designed to be used in a variety of applications, including industrial, automotive, medical, and consumer electronics. It is capable of supporting a wide range of digital and analog functions, including high-speed data transfer, audio and video processing, and power management. The chip model also features a wide range of integrated features, such as embedded memory, digital signal processing, and high-speed serial interfaces.
The XCV400E-8BGG432I chip model offers several advantages over traditional ICs. For example, it is designed to be highly flexible and can be used in a variety of applications. Additionally, the chip model has a low power consumption and can be used in low-power applications. Furthermore, the chip model is designed to be highly reliable and can be used in high-reliability applications.
The demand for the XCV400E-8BGG432I chip model is expected to remain strong in the future. This is due to its superior performance and flexibility, as well as its low power consumption and reliability. Additionally, the chip model is expected to be used in a variety of applications, including industrial, automotive, medical, and consumer electronics.
The XCV400E-8BGG432I chip model can be used in the development and popularization of future intelligent robots. This is due to its high performance, low power consumption, and flexibility. Additionally, the chip model is capable of supporting a wide range of digital and analog functions, including high-speed data transfer, audio and video processing, and power management. To use the model effectively, technical talents such as software engineers, hardware engineers, and system architects are needed.
In conclusion, the XCV400E-8BGG432I chip model is an advanced integrated circuit designed to meet the growing demand for high-performance, low-power, and low-cost ICs. It offers several advantages over traditional ICs, such as high flexibility, low power consumption, and high reliability. Additionally, the demand for the chip model is expected to remain strong in the future, and it can be used in the development and popularization of future intelligent robots. To use the model effectively, technical talents such as software engineers, hardware engineers, and system architects are needed.
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4,376 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $470.5044 | $470.5044 |
| 10+ | $465.4452 | $4,654.4520 |
| 100+ | $440.1493 | $44,014.9269 |
| 1000+ | $414.8533 | $207,426.6670 |
| 10000+ | $379.4390 | $379,439.0250 |
| The price is for reference only, please refer to the actual quotation! | ||