XCV400E-8BGG432C
XCV400E-8BGG432C
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rohs

AMD Xilinx

XCV400E-8BGG432C


XCV400E-8BGG432C
F20-XCV400E-8BGG432C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA-432
BGA-432

XCV400E-8BGG432C ECAD Model


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XCV400E-8BGG432C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 316
Number of Outputs 316
Number of Logic Cells 10800
Number of Equivalent Gates 129600
Number of CLBs 2400
Combinatorial Delay of a CLB-Max 400 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 2400 CLBS, 129600 GATES
Clock Frequency-Max 416 MHz
Power Supplies 1.2/3.6,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B432
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 432
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA432,31X31,50
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 40 mm
Length 40 mm
Seated Height-Max 1.7 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA-432
Pin Count 432
Reach Compliance Code unknown
HTS Code 8542.39.00.01
ECCN Code 3A991.D

XCV400E-8BGG432C Datasheet Download


XCV400E-8BGG432C Overview



The XCV400E-8BGG432C chip model is a powerful and versatile integrated circuit that has been designed to meet the needs of a wide range of applications. This chip model has been designed to provide high performance and low power consumption, making it an ideal choice for a variety of applications. It is capable of operating at a wide range of frequencies, making it suitable for use in a variety of networks and scenarios.


The XCV400E-8BGG432C chip model offers many advantages, including its low power consumption, high performance, and wide range of operating frequencies. This chip model also provides excellent signal integrity, which ensures that data is transmitted accurately and reliably. Additionally, it is compatible with a variety of communication protocols, making it suitable for use in a variety of networks and scenarios.


The XCV400E-8BGG432C chip model is expected to experience a strong demand in the future, as it is well-suited for use in a variety of applications. It is expected to be used in a variety of networks, such as 5G, Wi-Fi, and Bluetooth, as well as in intelligent scenarios such as autonomous vehicles, smart homes, and the Internet of Things (IoT). Additionally, this chip model is expected to be used in the era of fully intelligent systems, as it provides excellent signal integrity and compatibility with a variety of communication protocols.


The XCV400E-8BGG432C chip model is designed to meet the needs of a variety of applications. Its design requirements include a wide range of operating frequencies, low power consumption, high performance, and excellent signal integrity. Additionally, it is compatible with a variety of communication protocols, making it suitable for use in a variety of networks and scenarios.


In order to ensure successful implementation of the XCV400E-8BGG432C chip model, there are a few precautions to be taken. For example, it is important to ensure that the chip model is compatible with the system it is being used in, as well as the communication protocols it is expected to use. Additionally, it is important to ensure that the chip model is properly configured and that the appropriate drivers are installed.


In conclusion, the XCV400E-8BGG432C chip model is a powerful and versatile integrated circuit that is well-suited for use in a variety of applications. It offers many advantages, including its low power consumption, high performance, and wide range of operating frequencies. Additionally, it is expected to experience a strong demand in the future, as it is well-suited for use in a variety of networks and scenarios. It is important to take the necessary precautions when implementing this chip model, such as ensuring that it is compatible with the system it is being used in and that the appropriate drivers are installed.



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QTY Unit Price Ext Price
1+ $470.5044 $470.5044
10+ $465.4452 $4,654.4520
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1000+ $414.8533 $207,426.6670
10000+ $379.4390 $379,439.0250
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