
AMD Xilinx
XCV400E-8BGG432C
XCV400E-8BGG432C ECAD Model
XCV400E-8BGG432C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Inputs | 316 | |
Number of Outputs | 316 | |
Number of Logic Cells | 10800 | |
Number of Equivalent Gates | 129600 | |
Number of CLBs | 2400 | |
Combinatorial Delay of a CLB-Max | 400 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 2400 CLBS, 129600 GATES | |
Clock Frequency-Max | 416 MHz | |
Power Supplies | 1.2/3.6,1.8 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B432 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 432 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA432,31X31,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 1.7 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA-432 | |
Pin Count | 432 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A991.D |
XCV400E-8BGG432C Datasheet Download
XCV400E-8BGG432C Overview
The XCV400E-8BGG432C chip model is a powerful and versatile integrated circuit that has been designed to meet the needs of a wide range of applications. This chip model has been designed to provide high performance and low power consumption, making it an ideal choice for a variety of applications. It is capable of operating at a wide range of frequencies, making it suitable for use in a variety of networks and scenarios.
The XCV400E-8BGG432C chip model offers many advantages, including its low power consumption, high performance, and wide range of operating frequencies. This chip model also provides excellent signal integrity, which ensures that data is transmitted accurately and reliably. Additionally, it is compatible with a variety of communication protocols, making it suitable for use in a variety of networks and scenarios.
The XCV400E-8BGG432C chip model is expected to experience a strong demand in the future, as it is well-suited for use in a variety of applications. It is expected to be used in a variety of networks, such as 5G, Wi-Fi, and Bluetooth, as well as in intelligent scenarios such as autonomous vehicles, smart homes, and the Internet of Things (IoT). Additionally, this chip model is expected to be used in the era of fully intelligent systems, as it provides excellent signal integrity and compatibility with a variety of communication protocols.
The XCV400E-8BGG432C chip model is designed to meet the needs of a variety of applications. Its design requirements include a wide range of operating frequencies, low power consumption, high performance, and excellent signal integrity. Additionally, it is compatible with a variety of communication protocols, making it suitable for use in a variety of networks and scenarios.
In order to ensure successful implementation of the XCV400E-8BGG432C chip model, there are a few precautions to be taken. For example, it is important to ensure that the chip model is compatible with the system it is being used in, as well as the communication protocols it is expected to use. Additionally, it is important to ensure that the chip model is properly configured and that the appropriate drivers are installed.
In conclusion, the XCV400E-8BGG432C chip model is a powerful and versatile integrated circuit that is well-suited for use in a variety of applications. It offers many advantages, including its low power consumption, high performance, and wide range of operating frequencies. Additionally, it is expected to experience a strong demand in the future, as it is well-suited for use in a variety of networks and scenarios. It is important to take the necessary precautions when implementing this chip model, such as ensuring that it is compatible with the system it is being used in and that the appropriate drivers are installed.
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Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $470.5044 | $470.5044 |
10+ | $465.4452 | $4,654.4520 |
100+ | $440.1493 | $44,014.9269 |
1000+ | $414.8533 | $207,426.6670 |
10000+ | $379.4390 | $379,439.0250 |
The price is for reference only, please refer to the actual quotation! |