AMD Xilinx
XCV400E-7PQG240C
XCV400E-7PQG240C ECAD Model
XCV400E-7PQG240C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 158 | |
| Number of Outputs | 158 | |
| Number of Logic Cells | 10800 | |
| Number of Equivalent Gates | 129600 | |
| Number of CLBs | 2400 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2400 CLBS, 129600 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP240,1.3SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-240 | |
| Pin Count | 240 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XCV400E-7PQG240C Datasheet Download
XCV400E-7PQG240C Overview
The chip model XCV400E-7PQG240C is a highly advanced semiconductor device that has been designed to meet the needs of the modern communications industry. It is a multi-purpose chip that is capable of handling a wide range of tasks, from data transmission to signal processing. This chip is designed to provide a low-cost, high-performance solution for a variety of applications.
The XCV400E-7PQG240C is based on the latest cutting-edge technologies and provides the highest level of performance and reliability. It is capable of supporting multiple communication protocols and can be used in a wide range of applications. The chip can be used in both wired and wireless networks and has been designed to be highly scalable and flexible.
The chip is designed to be easily upgradable and can be used in a variety of communication systems. It is also capable of supporting new technologies, such as 5G and high-speed networks, as well as the latest applications. This makes the chip an ideal choice for a wide range of applications, including those in the automotive, medical, and industrial sectors.
In order to ensure that the chip is used in the most efficient way, it is important to understand the product description and specific design requirements of the chip model XCV400E-7PQG240C. This includes the original design intention of the chip and the possibility of future upgrades. It is also important to consider the application environment and whether or not the chip can support new technologies.
In addition, it is important to consider case studies and actual applications of the chip model XCV400E-7PQG240C. This can help to identify any potential issues and provide guidance on how to use the chip in the most effective way. It is also important to consider any safety precautions that may be necessary when using the chip.
In conclusion, the chip model XCV400E-7PQG240C is a highly advanced semiconductor device that can be used in a variety of applications. It is designed to provide a low-cost, high-performance solution for a variety of applications and can be used in both wired and wireless networks. It is also capable of supporting new technologies, such as 5G and high-speed networks, as well as the latest applications. It is important to understand the product description and specific design requirements of the chip model XCV400E-7PQG240C, as well as any potential issues and safety precautions that may be necessary when using the chip.
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