
AMD Xilinx
XCV400E-7FGG676I
XCV400E-7FGG676I ECAD Model
XCV400E-7FGG676I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Inputs | 404 | |
Number of Outputs | 404 | |
Number of Logic Cells | 10800 | |
Number of Equivalent Gates | 129600 | |
Number of CLBs | 2400 | |
Combinatorial Delay of a CLB-Max | 420 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 2400 CLBS, 129600 GATES | |
Clock Frequency-Max | 400 MHz | |
Power Supplies | 1.2/3.6,1.8 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B676 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 676 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA676,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | FBGA-676 | |
Pin Count | 676 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A991.D |
XCV400E-7FGG676I Datasheet Download
XCV400E-7FGG676I Overview
The XCV400E-7FGG676I chip model is a powerful and versatile tool for various industries. It has been designed to provide a reliable and efficient solution for many applications. It is an ideal choice for those looking for a reliable and cost-effective solution for their projects.
The XCV400E-7FGG676I chip model offers a variety of advantages over other chip models. It is capable of providing fast and reliable performance, and is also highly efficient. It is also compatible with a wide range of device types, making it ideal for a variety of applications. Furthermore, the chip model is designed to be highly reliable and secure, making it ideal for use in mission-critical applications.
The XCV400E-7FGG676I chip model is expected to be in high demand in the future, as more industries look to use this model in their applications. The chip model is expected to be used in a variety of industries, including medical, automotive, aerospace, and industrial. Furthermore, the chip model is expected to be used in a variety of applications, such as data processing, communication systems, and robotics.
The original design intention of the XCV400E-7FGG676I chip model was to provide a reliable and efficient solution for a variety of applications. The chip model was designed to be highly reliable and secure, making it ideal for use in mission-critical applications. Furthermore, the chip model was designed to be highly compatible with a wide range of device types, making it ideal for a variety of applications.
The XCV400E-7FGG676I chip model is also capable of being upgraded in the future. The chip model is designed to be highly efficient and reliable, making it ideal for use in a variety of applications. Furthermore, the chip model is capable of being upgraded to provide additional features and capabilities. This makes it ideal for use in a variety of applications, as the chip model can be upgraded to meet the needs of the application.
The XCV400E-7FGG676I chip model can also be applied to the development and popularization of future intelligent robots. The chip model is designed to be highly reliable and secure, making it ideal for use in mission-critical applications. Furthermore, the chip model is capable of being upgraded to provide additional features and capabilities, making it ideal for use in a variety of applications, such as robotics.
In order to effectively use the XCV400E-7FGG676I chip model, technical talents are needed. The chip model is designed to be highly reliable and secure, making it ideal for use in mission-critical applications. Furthermore, the chip model is capable of being upgraded to provide additional features and capabilities, making it ideal for use in a variety of applications. Therefore, technical talents are needed to ensure that the chip model can be used effectively in a variety of applications.
You May Also Be Interested In
5,045 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $156.2400 | $156.2400 |
10+ | $154.5600 | $1,545.6000 |
100+ | $146.1600 | $14,616.0000 |
1000+ | $137.7600 | $68,880.0000 |
10000+ | $126.0000 | $126,000.0000 |
The price is for reference only, please refer to the actual quotation! |