AMD Xilinx
XCV400E-7FGG676C
XCV400E-7FGG676C ECAD Model
XCV400E-7FGG676C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 404 | |
| Number of Outputs | 404 | |
| Number of Logic Cells | 10800 | |
| Number of Equivalent Gates | 129600 | |
| Number of CLBs | 2400 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2400 CLBS, 129600 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-676 | |
| Pin Count | 676 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XCV400E-7FGG676C Datasheet Download
XCV400E-7FGG676C Overview
The XCV400E-7FGG676C chip model is an advanced integrated circuit that has been designed with a wide range of applications in mind. It has been developed to provide high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language.
The original design intention of the XCV400E-7FGG676C chip model was to provide a powerful, efficient, and cost-effective solution for a variety of applications. This chip model has the potential to be upgraded in the future, allowing for more advanced capabilities and features. Furthermore, its use in advanced communication systems is possible, as it can be easily integrated into existing systems.
The XCV400E-7FGG676C chip model can also be applied to the development and popularization of future intelligent robots. This chip model provides the necessary tools for programming robots to perform complex tasks, such as navigation, object recognition, and voice recognition. To use the model effectively, technical talents such as programmers, engineers, and designers will be needed to develop the necessary algorithms.
In conclusion, the XCV400E-7FGG676C chip model is an advanced integrated circuit that has been designed with a wide range of applications in mind. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. It has the potential to be upgraded in the future, allowing for more advanced capabilities and features. Furthermore, its use in advanced communication systems is possible, as it can be easily integrated into existing systems. It can also be applied to the development and popularization of future intelligent robots, and technical talents such as programmers, engineers, and designers are needed to use the model effectively.
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2,907 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $156.2400 | $156.2400 |
| 10+ | $154.5600 | $1,545.6000 |
| 100+ | $146.1600 | $14,616.0000 |
| 1000+ | $137.7600 | $68,880.0000 |
| 10000+ | $126.0000 | $126,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||