AMD Xilinx
XCV400E-7BGG432C
XCV400E-7BGG432C ECAD Model
XCV400E-7BGG432C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 316 | |
| Number of Outputs | 316 | |
| Number of Logic Cells | 10800 | |
| Number of Equivalent Gates | 129600 | |
| Number of CLBs | 2400 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2400 CLBS, 129600 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B432 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 432 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA432,31X31,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-432 | |
| Pin Count | 432 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XCV400E-7BGG432C Datasheet Download
XCV400E-7BGG432C Overview
The chip model XCV400E-7BGG432C is a powerful, integrated digital signal processing system that is designed to meet the needs of high-performance digital signal processing, embedded processing, and image processing. It is based on a high-level hardware description language (HDL) and is capable of handling complex tasks with ease. The original design intention of the chip model XCV400E-7BGG432C was to provide a powerful platform for digital signal processing and embedded processing applications. It is also capable of future upgrades, allowing for more complex tasks to be handled.
The XCV400E-7BGG432C can be applied to advanced communication systems such as networks and intelligent systems. It has the potential to be used in a wide variety of scenarios, from intelligent home automation systems to autonomous vehicles. The chip model is able to handle complex tasks with ease and can process data quickly and accurately. This makes it ideal for applications in the era of fully intelligent systems.
The XCV400E-7BGG432C is a powerful and versatile chip model that can be used in a variety of scenarios. It is capable of handling complex tasks and can be used in advanced communication systems and intelligent systems. Its ability to process data quickly and accurately makes it an ideal choice for applications in the era of fully intelligent systems. Its original design intention and potential for future upgrades make it a great choice for any application that requires high-performance digital signal processing, embedded processing, and image processing.
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1,868 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $206.4600 | $206.4600 |
| 10+ | $204.2400 | $2,042.4000 |
| 100+ | $193.1400 | $19,314.0000 |
| 1000+ | $182.0400 | $91,020.0000 |
| 10000+ | $166.5000 | $166,500.0000 |
| The price is for reference only, please refer to the actual quotation! | ||