AMD Xilinx
XCV400E-6PQG240I
XCV400E-6PQG240I ECAD Model
XCV400E-6PQG240I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 158 | |
| Number of Outputs | 158 | |
| Number of Logic Cells | 10800 | |
| Number of Equivalent Gates | 129600 | |
| Number of CLBs | 2400 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2400 CLBS, 129600 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP240,1.3SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-240 | |
| Pin Count | 240 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
XCV400E-6PQG240I Datasheet Download
XCV400E-6PQG240I Overview
The XCV400E-6PQG240I chip model is a highly advanced integrated circuit designed to meet the needs of modern communication systems. This model is developed by a leading semiconductor manufacturer and is designed for a wide range of applications, including mobile phones, tablets, and other wireless communication devices.
The XCV400E-6PQG240I chip model is designed with a range of features that provide users with a high level of performance. It has a high-speed processor core, a powerful memory controller, and a wide range of communication interfaces. This model is also designed with a low power consumption rate and a wide range of power management features.
The XCV400E-6PQG240I chip model is also designed to be highly reliable and secure. It has a robust security architecture that includes a secure boot process and secure data storage. It also has a wide range of encryption and authentication protocols that can be used to protect data.
The XCV400E-6PQG240I chip model is also designed to be highly efficient. It has a low power consumption rate and a wide range of power management features. This model also has a wide range of power management features that allow users to optimize their system's power consumption.
The XCV400E-6PQG240I chip model also has a wide range of features that make it suitable for use in advanced communication systems. It is designed to be compatible with a wide range of communication protocols and can be used in a variety of wireless communication systems. It is also designed to be highly reliable and secure, making it suitable for use in mission-critical applications.
The XCV400E-6PQG240I chip model is expected to become increasingly popular in the coming years. This model is designed to meet the needs of modern communication systems and is expected to be widely used in a variety of industries, including mobile phones, tablets, and other wireless communication devices.
The original design intention of the XCV400E-6PQG240I chip model was to provide users with a high level of performance and reliability. It is designed to be highly efficient and secure, making it suitable for use in mission-critical applications. It is also designed to be compatible with a wide range of communication protocols and can be used in a variety of wireless communication systems.
The XCV400E-6PQG240I chip model is also designed to be highly upgradeable. It is designed to be able to support new features and technologies as they become available. This model is also designed to be able to support new communication protocols as they become available.
When designing the XCV400E-6PQG240I chip model, it is important to consider the specific design requirements for the model. This includes the power requirements, the communication protocols that the model must be compatible with, and the security protocols that must be implemented. It is also important to consider the cost and the availability of the model, as well as the availability of the necessary components.
In order to ensure the successful use of the XCV400E-6PQG240I chip model, it is important to consider the actual case studies and precautions that should be taken. This includes the proper use of the model, the proper installation and maintenance of the model, and the proper use of the security protocols. It is also important to consider the compatibility of the model with existing communication systems.
The XCV400E-6PQG240I chip model is a highly advanced integrated circuit designed to meet the needs of modern communication systems. It is designed to be highly efficient, reliable, and secure, making it suitable for use in mission-critical applications. It is also designed to be highly upgradeable and compatible with a wide range of communication protocols. The XCV400E-6PQG240I chip model is expected to become increasingly popular in the coming years and is expected to be widely used in a variety of industries. In order to ensure the successful use of the XCV400E-6PQG240I chip model, it is important to consider the specific design requirements, actual case studies, and precautions that should be taken.
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