AMD Xilinx
XCV400E-6FGG676I
XCV400E-6FGG676I ECAD Model
XCV400E-6FGG676I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 404 | |
| Number of Outputs | 404 | |
| Number of Logic Cells | 10800 | |
| Number of Equivalent Gates | 129600 | |
| Number of CLBs | 2400 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2400 CLBS, 129600 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-676 | |
| Pin Count | 676 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XCV400E-6FGG676I Datasheet Download
XCV400E-6FGG676I Overview
The chip model XCV400E-6FGG676I is a groundbreaking piece of technology, with features and capabilities that have revolutionized the chip manufacturing industry. This model is the latest development in the field of chip technology and is quickly becoming the new industry standard. The XCV400E-6FGG676I chip model is designed to be used in a wide variety of applications and is capable of performing complex tasks with ease.
The XCV400E-6FGG676I chip model is equipped with many advanced features that make it suitable for a wide range of applications. It has a high-performance processor, advanced memory management, and a wide range of peripherals. It also has a robust power management system that enables it to run for long periods of time without needing to be recharged. This makes it ideal for applications such as embedded systems and robotics.
The XCV400E-6FGG676I chip model is expected to be in high demand in the near future. This is due to its advanced features and capabilities, as well as its ability to be used in a variety of applications. As the demand for this model increases, the industry is expected to expand, creating new opportunities for chip manufacturers and developers.
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In conclusion, the chip model XCV400E-6FGG676I is a revolutionary piece of technology that is expected to be in high demand in the near future. It is capable of performing complex tasks with ease, making it suitable for a wide variety of applications. It is also suitable for the development and popularization of future intelligent robots and requires specialized technical talents to use it effectively.
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5,096 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $60.4500 | $60.4500 |
| 10+ | $59.8000 | $598.0000 |
| 100+ | $56.5500 | $5,655.0000 |
| 1000+ | $53.3000 | $26,650.0000 |
| 10000+ | $48.7500 | $48,750.0000 |
| The price is for reference only, please refer to the actual quotation! | ||