XCV400-6BGG560I
XCV400-6BGG560I
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rohs

AMD Xilinx

XCV400-6BGG560I


XCV400-6BGG560I
F20-XCV400-6BGG560I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, LBGA
LBGA

XCV400-6BGG560I ECAD Model


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XCV400-6BGG560I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Number of Equivalent Gates 468252
Number of CLBs 2400
Combinatorial Delay of a CLB-Max 600 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 2400 CLBS, 468252 GATES
Clock Frequency-Max 333 MHz
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B560
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 560
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 42.5 mm
Length 42.5 mm
Seated Height-Max 1.7 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description LBGA,
Pin Count 560
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCV400-6BGG560I Datasheet Download


XCV400-6BGG560I Overview



The XCV400-6BGG560I chip model is a powerful integrated circuit designed to tackle a variety of digital signal processing, embedded processing, and image processing applications. It is suitable for use in high-performance networks and intelligent scenarios, and is capable of being used in a fully intelligent system.


The XCV400-6BGG560I chip model is designed to be programmed with a hardware description language (HDL). This allows users to create a range of custom solutions to meet their specific needs. It has a wide range of features, including a high-performance processor, on-chip memory, and a variety of I/O ports. Furthermore, it is designed to be low power and low cost, making it an attractive solution for many applications.


When designing a system utilizing the XCV400-6BGG560I chip model, there are a few key considerations to keep in mind. It is important to ensure that the system is designed to take full advantage of the features available on the chip. Additionally, it is important to consider the power requirements of the chip, as well as the size and complexity of the system. Furthermore, it is important to ensure that the system is designed to be robust and reliable, as this is essential for any system that is intended for use in a high-performance network or intelligent scenario.


In order to better understand the potential applications of the XCV400-6BGG560I chip model, it is useful to look at some case studies of systems that have been designed using the chip. For example, a system was designed to process images in real-time using the XCV400-6BGG560I chip model. This system was able to process up to 10 million pixels per second, making it an ideal solution for image processing applications. Additionally, a system was designed to provide a secure and reliable communication channel between two computers using the XCV400-6BGG560I chip model. This system was able to provide a secure and reliable connection, making it an ideal solution for secure communication applications.


When using the XCV400-6BGG560I chip model, it is important to ensure that all safety and security precautions are taken into consideration. Additionally, it is important to ensure that the system is designed to be robust and reliable, as this is essential for any system that is intended for use in a high-performance network or intelligent scenario. Finally, it is important to ensure that the system is designed to take full advantage of the features available on the chip, as this will ensure that the system is able to perform its intended tasks effectively and efficiently.



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