XCV400-6BGG560C
XCV400-6BGG560C
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rohs

AMD Xilinx

XCV400-6BGG560C


XCV400-6BGG560C
F20-XCV400-6BGG560C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, LBGA
LBGA

XCV400-6BGG560C ECAD Model


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XCV400-6BGG560C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Number of Equivalent Gates 468252
Number of CLBs 2400
Combinatorial Delay of a CLB-Max 600 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 2400 CLBS, 468252 GATES
Clock Frequency-Max 333 MHz
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B560
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 560
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 42.5 mm
Length 42.5 mm
Seated Height-Max 1.7 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description LBGA,
Pin Count 560
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCV400-6BGG560C Datasheet Download


XCV400-6BGG560C Overview



The XCV400-6BGG560C chip model is a high-performance digital signal processor (DSP) designed for applications such as embedded processing, image processing, and other high-performance digital signal processing. It is a powerful and versatile chip model that is capable of meeting the needs of a wide range of applications.


The XCV400-6BGG560C chip model is designed to be used with the HDL language, which is a hardware description language used to create digital designs. This language is used to create digital designs that can be used for a variety of applications. It allows for the design of complex digital systems with a high degree of accuracy and speed.


The XCV400-6BGG560C chip model is designed to be used in a variety of applications, including embedded systems, image processing, and other digital signal processing applications. The chip model is designed to be highly efficient and reliable, allowing for the creation of complex designs that are able to meet the needs of a wide range of applications.


In terms of industry trends, the XCV400-6BGG560C chip model is designed to be used in a variety of applications and is expected to be used in a wide range of applications in the future. The chip model is expected to be used in applications such as autonomous vehicles, artificial intelligence, and robotics. These applications are expected to require the use of new technologies and support from the chip model.


The product description and design requirements of the XCV400-6BGG560C chip model are detailed in the product manual. This manual provides information about the chip model, its features, and its design requirements. It also provides guidance on how to use the chip model in different applications. Additionally, the product manual provides information about actual case studies and best practices for using the chip model in different applications.


Overall, the XCV400-6BGG560C chip model is a powerful and versatile digital signal processor designed for a variety of applications. It is designed to be used with the HDL language and is expected to be used in a variety of applications in the future. The product manual provides detailed information about the chip model, its features, and its design requirements. Additionally, it provides information about actual case studies and best practices for using the chip model in different applications.



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QTY Unit Price Ext Price
1+ $63.3709 $63.3709
10+ $62.6895 $626.8954
100+ $59.2825 $5,928.2496
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10000+ $51.1056 $51,105.6000
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