AMD Xilinx
XCV400-6BG432I
XCV400-6BG432I ECAD Model
XCV400-6BG432I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 316 | |
| Number of Outputs | 316 | |
| Number of Logic Cells | 10800 | |
| Number of Equivalent Gates | 468252 | |
| Number of CLBs | 2400 | |
| Combinatorial Delay of a CLB-Max | 600 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2400 CLBS, 468252 GATES | |
| Clock Frequency-Max | 333 MHz | |
| Power Supplies | 1.2/3.6,2.5 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B432 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 432 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA432,31X31,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-432 | |
| Pin Count | 432 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCV400-6BG432I Datasheet Download
XCV400-6BG432I Overview
The XCV400-6BG432I chip model is a powerful solution for high-performance digital signal processing, embedded processing, image processing, and other applications. It is designed to be an efficient and cost-effective solution for a wide range of applications. It is designed to be a scalable and upgradable solution that can be used in advanced communication systems.
The XCV400-6BG432I chip model is a powerful and efficient solution for high-performance digital signal processing, embedded processing, and image processing. It is designed to be a cost-effective solution for a wide range of applications. It is designed to be a scalable and upgradable solution that can be used in advanced communication systems. It is also suitable for the development and popularization of future intelligent robots.
The XCV400-6BG432I chip model is designed to use the HDL language. It is a powerful and efficient solution for high-performance digital signal processing, embedded processing, and image processing. It is designed to be a cost-effective solution for a wide range of applications. It is also suitable for the development and popularization of future intelligent robots. To use the model effectively, technical talents with knowledge of HDL language and digital circuit design are needed.
In conclusion, the XCV400-6BG432I chip model is a powerful solution for high-performance digital signal processing, embedded processing, image processing, and other applications. It is designed to be an efficient and cost-effective solution for a wide range of applications. It is designed to be a scalable and upgradable solution that can be used in advanced communication systems. It is also suitable for the development and popularization of future intelligent robots. To use the model effectively, technical talents with knowledge of HDL language and digital circuit design are needed.
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1,726 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $96.7200 | $96.7200 |
| 10+ | $95.6800 | $956.8000 |
| 100+ | $90.4800 | $9,048.0000 |
| 1000+ | $85.2800 | $42,640.0000 |
| 10000+ | $78.0000 | $78,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||