
AMD Xilinx
XCV400-5FGG676I
XCV400-5FGG676I ECAD Model
XCV400-5FGG676I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Equivalent Gates | 468252 | |
Number of CLBs | 2400 | |
Combinatorial Delay of a CLB-Max | 700 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 2400 CLBS, 468252 GATES | |
Clock Frequency-Max | 294 MHz | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B676 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 676 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, | |
Pin Count | 676 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCV400-5FGG676I Datasheet Download
XCV400-5FGG676I Overview
The XCV400-5FGG676I chip model is a high-performance chip designed for digital signal processing, embedded processing, and image processing. It requires the use of HDL language, making it suitable for a variety of applications. As the chip model continues to evolve and become more advanced, it can be used in a variety of new and innovative ways.
The chip model is already being used in a variety of industries, and its potential applications are only increasing. It has the potential to be used in the development and popularization of future intelligent robots, as well as in other areas such as medical imaging, video and audio processing, and machine learning. To use the chip model effectively, it requires a certain level of technical expertise, such as knowledge of HDL language and experience with related technologies.
The industry trends of the chip model XCV400-5FGG676I suggest that it will continue to be used in many different applications, and new technologies may be required to support its use in the future. For example, the chip model may require the use of artificial intelligence technology to enable it to be used in the development and popularization of future intelligent robots. Additionally, the chip model may require new technologies such as 5G networks, cloud computing, and edge computing to enable it to be used in more sophisticated applications.
The chip model XCV400-5FGG676I has the potential to be used in a variety of applications, and its use will require the support of new technologies. To make the most of the chip model, it is important to have the necessary technical expertise, such as knowledge of HDL language and experience with related technologies. With the right knowledge and experience, the chip model can be used to develop and popularize intelligent robots, as well as in other areas such as medical imaging, video and audio processing, and machine learning.
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5,296 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $178.5600 | $178.5600 |
10+ | $176.6400 | $1,766.4000 |
100+ | $167.0400 | $16,704.0000 |
1000+ | $157.4400 | $78,720.0000 |
10000+ | $144.0000 | $144,000.0000 |
The price is for reference only, please refer to the actual quotation! |