XCV400-5FGG676I
XCV400-5FGG676I
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rohs

AMD Xilinx

XCV400-5FGG676I


XCV400-5FGG676I
F20-XCV400-5FGG676I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA
BGA

XCV400-5FGG676I ECAD Model


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XCV400-5FGG676I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Number of Equivalent Gates 468252
Number of CLBs 2400
Combinatorial Delay of a CLB-Max 700 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 2400 CLBS, 468252 GATES
Clock Frequency-Max 294 MHz
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B676
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 676
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA,
Pin Count 676
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCV400-5FGG676I Datasheet Download


XCV400-5FGG676I Overview



The XCV400-5FGG676I chip model is a high-performance chip designed for digital signal processing, embedded processing, and image processing. It requires the use of HDL language, making it suitable for a variety of applications. As the chip model continues to evolve and become more advanced, it can be used in a variety of new and innovative ways.


The chip model is already being used in a variety of industries, and its potential applications are only increasing. It has the potential to be used in the development and popularization of future intelligent robots, as well as in other areas such as medical imaging, video and audio processing, and machine learning. To use the chip model effectively, it requires a certain level of technical expertise, such as knowledge of HDL language and experience with related technologies.


The industry trends of the chip model XCV400-5FGG676I suggest that it will continue to be used in many different applications, and new technologies may be required to support its use in the future. For example, the chip model may require the use of artificial intelligence technology to enable it to be used in the development and popularization of future intelligent robots. Additionally, the chip model may require new technologies such as 5G networks, cloud computing, and edge computing to enable it to be used in more sophisticated applications.


The chip model XCV400-5FGG676I has the potential to be used in a variety of applications, and its use will require the support of new technologies. To make the most of the chip model, it is important to have the necessary technical expertise, such as knowledge of HDL language and experience with related technologies. With the right knowledge and experience, the chip model can be used to develop and popularize intelligent robots, as well as in other areas such as medical imaging, video and audio processing, and machine learning.



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QTY Unit Price Ext Price
1+ $178.5600 $178.5600
10+ $176.6400 $1,766.4000
100+ $167.0400 $16,704.0000
1000+ $157.4400 $78,720.0000
10000+ $144.0000 $144,000.0000
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