AMD Xilinx
XCV400-5FGG676C
XCV400-5FGG676C ECAD Model
XCV400-5FGG676C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 468252 | |
| Number of CLBs | 2400 | |
| Combinatorial Delay of a CLB-Max | 700 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2400 CLBS, 468252 GATES | |
| Clock Frequency-Max | 294 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 676 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV400-5FGG676C Datasheet Download
XCV400-5FGG676C Overview
The XCV400-5FGG676C chip model is a high-performance digital signal processor designed for embedded processing, image processing, and other applications. It is designed to be used with the HDL language, allowing for improved performance and more efficient development.
The chip model is well-suited to the modern industry, as it provides a high level of performance and flexibility. It is capable of handling a variety of tasks, from data processing to image processing, and is suitable for a wide range of applications. The chip model also supports new technologies, which can help further improve its performance and capabilities.
When designing with the XCV400-5FGG676C chip model, it is important to be aware of the specific design requirements and the product description. The chip model should be used according to the specific design requirements, and the product description should be read carefully in order to ensure that the chip model is used correctly. Additionally, it is important to consider actual case studies and precautions when designing with the chip model.
In conclusion, the XCV400-5FGG676C chip model is a powerful and versatile digital signal processor that is well-suited to the modern industry. It is capable of handling a variety of tasks, and is suitable for a wide range of applications. Additionally, it supports new technologies, which can help further improve its performance and capabilities. When designing with the chip model, it is important to be aware of the specific design requirements and the product description, as well as actual case studies and precautions.
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1,034 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $178.5600 | $178.5600 |
| 10+ | $176.6400 | $1,766.4000 |
| 100+ | $167.0400 | $16,704.0000 |
| 1000+ | $157.4400 | $78,720.0000 |
| 10000+ | $144.0000 | $144,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||