XCV400-5BGG560I
XCV400-5BGG560I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XCV400-5BGG560I


XCV400-5BGG560I
F20-XCV400-5BGG560I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, LBGA
LBGA

XCV400-5BGG560I ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

XCV400-5BGG560I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Number of Equivalent Gates 468252
Number of CLBs 2400
Combinatorial Delay of a CLB-Max 700 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 2400 CLBS, 468252 GATES
Clock Frequency-Max 294 MHz
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
JESD-30 Code S-PBGA-B560
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 560
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 42.5 mm
Length 42.5 mm
Seated Height-Max 1.7 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description LBGA,
Pin Count 560
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCV400-5BGG560I Datasheet Download


XCV400-5BGG560I Overview



The XCV400-5BGG560I chip model is a powerful, reliable, and cost-effective semiconductor device that offers a wide range of features and benefits for many industries. With its high-speed processing capabilities, low power consumption, and high-precision data processing, the XCV400-5BGG560I is an ideal choice for a variety of applications.


The XCV400-5BGG560I chip model is designed to provide advanced capabilities for applications such as artificial intelligence, machine learning, and robotics. It has a wide range of features, including an integrated high-performance processor, an integrated memory controller, and an integrated signal processing unit. It also supports multiple communication protocols, including Ethernet, USB, and CAN. The XCV400-5BGG560I chip model is also designed to be compatible with a variety of operating systems, including Windows, Linux, and Android.


The XCV400-5BGG560I chip model has a wide range of advantages, including high-speed processing, low power consumption, and high-precision data processing. It can also be used in a variety of applications, including autonomous vehicles, medical devices, and industrial automation. As the demand for advanced semiconductor devices continues to grow, the XCV400-5BGG560I chip model is expected to become increasingly popular in the near future.


When it comes to the product description and specific design requirements of the XCV400-5BGG560I chip model, it is important to note that the chip model is designed to be compatible with a variety of operating systems, including Windows, Linux, and Android. Additionally, the chip model is designed to offer advanced capabilities for applications such as artificial intelligence, machine learning, and robotics. Furthermore, the chip model is designed to provide high-speed processing, low power consumption, and high-precision data processing.


In terms of actual case studies and precautions, it is important to note that the XCV400-5BGG560I chip model has been successfully applied to a variety of applications, including autonomous vehicles, medical devices, and industrial automation. Additionally, the chip model has been used in a variety of projects, including the development of autonomous robots and the development of artificial intelligence algorithms.


When it comes to the application of the XCV400-5BGG560I chip model to the development and popularization of future intelligent robots, it is important to note that the chip model is capable of providing advanced capabilities for applications such as artificial intelligence, machine learning, and robotics. Additionally, the chip model is designed to be compatible with a variety of operating systems, including Windows, Linux, and Android. Furthermore, the chip model is designed to provide high-speed processing, low power consumption, and high-precision data processing. In order to effectively use the XCV400-5BGG560I chip model, it is important to have a strong background in computer science and engineering, as well as experience in programming and software development.



5,593 In Stock


I want to buy

Unit Price: N/A
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
No reference price found.

Quick Quote