
AMD Xilinx
XCV400-5BGG560I
XCV400-5BGG560I ECAD Model
XCV400-5BGG560I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Equivalent Gates | 468252 | |
Number of CLBs | 2400 | |
Combinatorial Delay of a CLB-Max | 700 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 2400 CLBS, 468252 GATES | |
Clock Frequency-Max | 294 MHz | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B560 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 560 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 1.7 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | LBGA, | |
Pin Count | 560 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCV400-5BGG560I Datasheet Download
XCV400-5BGG560I Overview
The XCV400-5BGG560I chip model is a powerful, reliable, and cost-effective semiconductor device that offers a wide range of features and benefits for many industries. With its high-speed processing capabilities, low power consumption, and high-precision data processing, the XCV400-5BGG560I is an ideal choice for a variety of applications.
The XCV400-5BGG560I chip model is designed to provide advanced capabilities for applications such as artificial intelligence, machine learning, and robotics. It has a wide range of features, including an integrated high-performance processor, an integrated memory controller, and an integrated signal processing unit. It also supports multiple communication protocols, including Ethernet, USB, and CAN. The XCV400-5BGG560I chip model is also designed to be compatible with a variety of operating systems, including Windows, Linux, and Android.
The XCV400-5BGG560I chip model has a wide range of advantages, including high-speed processing, low power consumption, and high-precision data processing. It can also be used in a variety of applications, including autonomous vehicles, medical devices, and industrial automation. As the demand for advanced semiconductor devices continues to grow, the XCV400-5BGG560I chip model is expected to become increasingly popular in the near future.
When it comes to the product description and specific design requirements of the XCV400-5BGG560I chip model, it is important to note that the chip model is designed to be compatible with a variety of operating systems, including Windows, Linux, and Android. Additionally, the chip model is designed to offer advanced capabilities for applications such as artificial intelligence, machine learning, and robotics. Furthermore, the chip model is designed to provide high-speed processing, low power consumption, and high-precision data processing.
In terms of actual case studies and precautions, it is important to note that the XCV400-5BGG560I chip model has been successfully applied to a variety of applications, including autonomous vehicles, medical devices, and industrial automation. Additionally, the chip model has been used in a variety of projects, including the development of autonomous robots and the development of artificial intelligence algorithms.
When it comes to the application of the XCV400-5BGG560I chip model to the development and popularization of future intelligent robots, it is important to note that the chip model is capable of providing advanced capabilities for applications such as artificial intelligence, machine learning, and robotics. Additionally, the chip model is designed to be compatible with a variety of operating systems, including Windows, Linux, and Android. Furthermore, the chip model is designed to provide high-speed processing, low power consumption, and high-precision data processing. In order to effectively use the XCV400-5BGG560I chip model, it is important to have a strong background in computer science and engineering, as well as experience in programming and software development.
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