AMD Xilinx
XCV400-5BGG560C
XCV400-5BGG560C ECAD Model
XCV400-5BGG560C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 468252 | |
| Number of CLBs | 2400 | |
| Combinatorial Delay of a CLB-Max | 700 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2400 CLBS, 468252 GATES | |
| Clock Frequency-Max | 294 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 560 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV400-5BGG560C Datasheet Download
XCV400-5BGG560C Overview
The chip model XCV400-5BGG560C is a cutting-edge product of the semiconductor industry and has been widely used in various fields. It has the characteristics of high integration, low power consumption and strong performance. It is a key component in the development of advanced communication systems.
This chip model is designed to meet the current needs of the industry. It has the advantages of low power consumption, high performance and high integration, which can effectively reduce the cost of equipment. At the same time, it also has the features of high reliability and low noise interference, which can effectively improve the stability of the system.
The chip model XCV400-5BGG560C can be applied in various intelligent scenarios. It can be used in the era of fully intelligent systems, providing a powerful support for the development of the Internet of Things, artificial intelligence, 5G and other technologies. It can also be used in various industrial fields, such as automotive, industrial automation, medical, consumer electronics, etc.
In the future, the chip model XCV400-5BGG560C will continue to be upgraded to meet the needs of the industry. It will be equipped with more powerful functions and technologies, such as AI, 5G, and IoT, to enable more efficient and intelligent applications. It is expected that the chip model XCV400-5BGG560C will be widely used in the future, and will become an important part of the development of advanced communication systems.
In summary, the chip model XCV400-5BGG560C is a cutting-edge product of the semiconductor industry. It has the advantages of low power consumption, high performance and high integration, and can be applied to various intelligent scenarios. In the future, it will continue to be upgraded to meet the needs of the industry, and will become an important part of the development of advanced communication systems.
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2,214 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $372.3676 | $372.3676 |
| 10+ | $368.3637 | $3,683.6368 |
| 100+ | $348.3439 | $34,834.3911 |
| 1000+ | $328.3241 | $164,162.0730 |
| 10000+ | $300.2965 | $300,296.4750 |
| The price is for reference only, please refer to the actual quotation! | ||