AMD Xilinx
XCV400-5BGG432C
XCV400-5BGG432C ECAD Model
XCV400-5BGG432C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 468252 | |
| Number of CLBs | 2400 | |
| Combinatorial Delay of a CLB-Max | 700 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2400 CLBS, 468252 GATES | |
| Clock Frequency-Max | 294 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B432 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 432 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 432 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV400-5BGG432C Datasheet Download
XCV400-5BGG432C Overview
The chip model XCV400-5BGG432C is a revolutionary breakthrough in the semiconductor industry, with its advanced features and capabilities. It is a highly integrated, low power, and cost-effective solution for embedded systems. This chip model has been widely used in many industries, including automotive, consumer electronics, industrial, medical, and more.
The XCV400-5BGG432C chip is capable of providing high performance and low power consumption, enabling it to be used in a wide range of applications. It is also capable of supporting a variety of communication protocols, such as USB, Ethernet, and Wi-Fi. This chip model is designed to be flexible, allowing for a wide range of customization and integration.
The XCV400-5BGG432C chip is expected to remain in high demand in the future, as the technology it supports continues to evolve and become more widely used. As the technology advances, the chip model will become increasingly powerful and capable of supporting a wide range of new applications. This chip model is also expected to be used in the development and popularization of future intelligent robots, as it can provide the necessary hardware support for the robots to function properly.
In order to use the XCV400-5BGG432C chip effectively, a certain level of technical expertise is needed. The chip model requires a deep understanding of embedded systems, as well as a good grasp of communication protocols and software development. Additionally, experience with microcontrollers, sensors, and other components will be beneficial in using the chip model.
In conclusion, the XCV400-5BGG432C chip is a powerful and cost-effective solution for embedded systems. It is expected to remain in high demand in the future, and its use in the development and popularization of future intelligent robots is likely. However, using this chip model effectively requires a certain level of technical expertise, making it important for those who are interested in using the chip model to gain the necessary skills and knowledge.
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1,466 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $62.4960 | $62.4960 |
| 10+ | $61.8240 | $618.2400 |
| 100+ | $58.4640 | $5,846.4000 |
| 1000+ | $55.1040 | $27,552.0000 |
| 10000+ | $50.4000 | $50,400.0000 |
| The price is for reference only, please refer to the actual quotation! | ||