AMD Xilinx
XCV400-4FGG676I
XCV400-4FGG676I ECAD Model
XCV400-4FGG676I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 468252 | |
| Number of CLBs | 2400 | |
| Combinatorial Delay of a CLB-Max | 800 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2400 CLBS, 468252 GATES | |
| Clock Frequency-Max | 250 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B676 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 676 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 676 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV400-4FGG676I Datasheet Download
XCV400-4FGG676I Overview
The chip model XCV400-4FGG676I is a high-performance integrated circuit designed for digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, making it an ideal choice for applications that require high performance.
The chip model XCV400-4FGG676I is well-suited to the development of future intelligent robots, as it is capable of handling complex tasks and data processing. As technology advances, the chip model XCV400-4FGG676I can be adapted to support new technologies, making it a versatile choice for a range of applications.
In order to effectively use the chip model XCV400-4FGG676I for the development and popularization of future intelligent robots, technical talents with a deep understanding of the HDL language and the chip model XCV400-4FGG676I are essential. They should have a strong background in digital signal processing, embedded processing, and image processing, as well as knowledge of the specific technologies that are needed for the application environment.
In conclusion, the chip model XCV400-4FGG676I is an ideal choice for high-performance digital signal processing, embedded processing, and image processing applications. It is also well-suited for the development and popularization of future intelligent robots, provided that the necessary technical talents are available. As technology advances, the chip model XCV400-4FGG676I can be adapted to support new technologies, making it a versatile choice for a range of applications.
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1,667 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $165.1680 | $165.1680 |
| 10+ | $163.3920 | $1,633.9200 |
| 100+ | $154.5120 | $15,451.2000 |
| 1000+ | $145.6320 | $72,816.0000 |
| 10000+ | $133.2000 | $133,200.0000 |
| The price is for reference only, please refer to the actual quotation! | ||