AMD Xilinx
XCV400-4BGG560C
XCV400-4BGG560C ECAD Model
XCV400-4BGG560C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Equivalent Gates | 468252 | |
| Number of CLBs | 2400 | |
| Combinatorial Delay of a CLB-Max | 800 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2400 CLBS, 468252 GATES | |
| Clock Frequency-Max | 250 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B560 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 560 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 560 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV400-4BGG560C Datasheet Download
XCV400-4BGG560C Overview
The XCV400-4BGG560C chip model is a powerful and versatile tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used in conjunction with a high-level HDL language, which allows for efficient and reliable programming. This chip model is currently being used in many industries, and its future applications are likely to be even more expansive.
The industry trends in the chip model XCV400-4BGG560C are constantly evolving, and new technologies are being developed to support its application environment. For example, the use of artificial intelligence and machine learning algorithms can help to improve the efficiency and accuracy of the chip model’s performance. As the digital world continues to evolve, the chip model will also be able to support more complex tasks and applications.
The chip model XCV400-4BGG560C is also being used in many network applications, such as the Internet of Things (IoT) and other intelligent systems. Its ability to process data quickly and accurately makes it an ideal tool for these applications. In addition, the chip model is also being used in artificial intelligence (AI) and machine learning (ML) applications, allowing for more intelligent scenarios and decisions.
The chip model XCV400-4BGG560C is a powerful tool for the future of digital signal processing, embedded processing, and image processing. With the advancement of technology, it is likely that the chip model will be used in the era of fully intelligent systems. Its ability to process data quickly and accurately makes it a great choice for many network applications, as well as for AI and ML applications. With the increasing demand for more advanced and efficient technologies, the chip model XCV400-4BGG560C is sure to be a valuable asset for many industries in the future.
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3,344 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $96.7200 | $96.7200 |
| 10+ | $95.6800 | $956.8000 |
| 100+ | $90.4800 | $9,048.0000 |
| 1000+ | $85.2800 | $42,640.0000 |
| 10000+ | $78.0000 | $78,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||