
AMD Xilinx
XCV400-4BGG432I
XCV400-4BGG432I ECAD Model
XCV400-4BGG432I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Number of Equivalent Gates | 468252 | |
Number of CLBs | 2400 | |
Combinatorial Delay of a CLB-Max | 800 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 2400 CLBS, 468252 GATES | |
Clock Frequency-Max | 250 MHz | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B432 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 432 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 1.7 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | LBGA, | |
Pin Count | 432 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCV400-4BGG432I Datasheet Download
XCV400-4BGG432I Overview
The chip model XCV400-4BGG432I is a high-performance integrated circuit designed to meet the needs of advanced communication systems. It is a highly integrated, low-power, and low-cost solution for a variety of wireless and wired applications. This model provides a wide range of features and functions including high-speed data transfer, low power consumption, and wide frequency range.
The chip model XCV400-4BGG432I is designed to be used in a wide range of applications including mobile phones, wireless networking, and other communication systems. It supports a variety of data rates and can be used in both wired and wireless systems. It is also capable of supporting a variety of modulation schemes, including CDMA, TDMA, and OFDM.
In terms of industry trends, the chip model XCV400-4BGG432I is a great choice for applications that require high performance and low power consumption. It is also an ideal choice for applications that are looking to improve their data transfer rate and reduce their power consumption. As the demand for high performance and low power consumption continues to increase, the chip model XCV400-4BGG432I will remain a popular choice for many applications.
The chip model XCV400-4BGG432I is designed to be highly upgradable and flexible. It is designed to be able to support a variety of new technologies as needed. This makes it an ideal choice for applications that require support for new technologies. Additionally, the chip model XCV400-4BGG432I is designed to be able to support a variety of modulation schemes, making it an ideal choice for applications that require support for a variety of modulation schemes.
In terms of product description, the chip model XCV400-4BGG432I is designed to be a low-power, low-cost solution for a variety of wireless and wired applications. It features a wide range of features and functions including high-speed data transfer, low power consumption, and wide frequency range. Additionally, it is designed to be highly upgradable and flexible, making it an ideal choice for applications that require support for new technologies.
When it comes to actual case studies and precautions, the chip model XCV400-4BGG432I is designed to be highly reliable and efficient. It is designed to be able to handle a variety of demanding applications and environments. However, it is important to note that it is not designed to be used in extreme environments, as it may not be able to handle the extreme temperatures, pressures, and other factors that may be present in these environments. Additionally, it is important to ensure that the chip model XCV400-4BGG432I is properly installed and maintained in order to ensure optimal performance.
In conclusion, the chip model XCV400-4BGG432I is a great choice for applications that require high performance and low power consumption. It is designed to be highly upgradable and flexible, making it an ideal choice for applications that require support for new technologies. Additionally, it is designed to be highly reliable and efficient, making it an ideal choice for a variety of applications. However, it is important to ensure that it is properly installed and maintained in order to ensure optimal performance.
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