
AMD Xilinx
XCV3200E-8FGG1156C
XCV3200E-8FGG1156C ECAD Model
XCV3200E-8FGG1156C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.8 V | |
Number of Inputs | 804 | |
Number of Outputs | 804 | |
Number of Logic Cells | 73008 | |
Number of CLBs | 18252 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Clock Frequency-Max | 416 MHz | |
Power Supplies | 1.2/3.6,1.8 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B1156 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 85 °C | |
Number of Terminals | 1156 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1156,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
XCV3200E-8FGG1156C Datasheet Download
XCV3200E-8FGG1156C Overview
The XCV3200E-8FGG1156C chip model is a powerful and versatile tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to make the most efficient use of hardware resources, allowing developers to create sophisticated systems with minimal hardware. The chip model is capable of supporting up to eight cores and uses a high-level HDL language for programming.
The XCV3200E-8FGG1156C chip model was designed to provide an upgradeable platform for future applications. It has built-in features such as high-speed memory access, advanced communication protocols, and a powerful instruction set architecture, allowing it to be used in a variety of applications. Furthermore, the chip model can be used to develop and popularize future intelligent robots, as it has the necessary hardware and software resources to support the development of such systems.
To use the XCV3200E-8FGG1156C chip model effectively, developers need to have a good understanding of HDL language, as well as a strong knowledge of the chip model's features and capabilities. Furthermore, they need to be familiar with the various communication protocols and the instruction set architecture of the chip model. Additionally, they need to have a good understanding of the hardware and software resources available in the chip model, as well as the capabilities of the various components. With the right skills and knowledge, developers can create powerful and advanced communication systems with the XCV3200E-8FGG1156C chip model.
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1,297 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $346.9086 | $346.9086 |
10+ | $343.1784 | $3,431.7840 |
100+ | $324.5274 | $32,452.7400 |
1000+ | $305.8764 | $152,938.2000 |
10000+ | $279.7650 | $279,765.0000 |
The price is for reference only, please refer to the actual quotation! |