XCV3200E-8FGG1156C
XCV3200E-8FGG1156C
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rohs

AMD Xilinx

XCV3200E-8FGG1156C


XCV3200E-8FGG1156C
F20-XCV3200E-8FGG1156C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS
BGA

XCV3200E-8FGG1156C ECAD Model


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XCV3200E-8FGG1156C Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 1.8 V
Number of Inputs 804
Number of Outputs 804
Number of Logic Cells 73008
Number of CLBs 18252
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 416 MHz
Power Supplies 1.2/3.6,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B1156
Qualification Status Not Qualified
Operating Temperature-Max 85 °C
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1156,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Ihs Manufacturer XILINX INC
Reach Compliance Code compliant
HTS Code 8542.39.00.01

XCV3200E-8FGG1156C Datasheet Download


XCV3200E-8FGG1156C Overview



The XCV3200E-8FGG1156C chip model is a powerful and versatile tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to make the most efficient use of hardware resources, allowing developers to create sophisticated systems with minimal hardware. The chip model is capable of supporting up to eight cores and uses a high-level HDL language for programming.


The XCV3200E-8FGG1156C chip model was designed to provide an upgradeable platform for future applications. It has built-in features such as high-speed memory access, advanced communication protocols, and a powerful instruction set architecture, allowing it to be used in a variety of applications. Furthermore, the chip model can be used to develop and popularize future intelligent robots, as it has the necessary hardware and software resources to support the development of such systems.


To use the XCV3200E-8FGG1156C chip model effectively, developers need to have a good understanding of HDL language, as well as a strong knowledge of the chip model's features and capabilities. Furthermore, they need to be familiar with the various communication protocols and the instruction set architecture of the chip model. Additionally, they need to have a good understanding of the hardware and software resources available in the chip model, as well as the capabilities of the various components. With the right skills and knowledge, developers can create powerful and advanced communication systems with the XCV3200E-8FGG1156C chip model.



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Unit Price: $373.02
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Pricing (USD)

QTY Unit Price Ext Price
1+ $346.9086 $346.9086
10+ $343.1784 $3,431.7840
100+ $324.5274 $32,452.7400
1000+ $305.8764 $152,938.2000
10000+ $279.7650 $279,765.0000
The price is for reference only, please refer to the actual quotation!

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