AMD Xilinx
XCV3200E-7FGG1156C
XCV3200E-7FGG1156C ECAD Model
XCV3200E-7FGG1156C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 804 | |
| Number of Outputs | 804 | |
| Number of Logic Cells | 73008 | |
| Number of CLBs | 18252 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B1156 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1156,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV3200E-7FGG1156C Datasheet Download
XCV3200E-7FGG1156C Overview
The XCV3200E-7FGG1156C chip model is a powerful and versatile tool for digital signal processing, embedded processing, image processing, and other applications. The chip is designed to be used with the HDL language, making it an ideal choice for those who need high performance and reliable data processing.
The chip model is already being used in a variety of industries, and its potential applications are only growing. In the future, the chip model could be used in networks and intelligent systems, providing a robust platform for data processing. It could be used to support a wide range of applications, from autonomous vehicles to smart home systems.
The XCV3200E-7FGG1156C chip model is also well-suited for the era of fully intelligent systems. It has the potential to provide the necessary infrastructure for the development of sophisticated AI systems. By utilizing the chip's powerful processing capabilities, developers can create sophisticated AI systems that can be used in a variety of applications.
The chip model is also designed to be flexible, allowing developers to customize it to meet their specific needs. With its ability to support a wide range of technologies, the XCV3200E-7FGG1156C chip model is an ideal choice for those who need a reliable and powerful platform for data processing. As the industry continues to evolve, the chip model will continue to be an important tool for developers looking to create powerful and reliable systems.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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