
AMD Xilinx
XCV3200E-7FG1156I
XCV3200E-7FG1156I ECAD Model
XCV3200E-7FG1156I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Inputs | 804 | |
Number of Outputs | 804 | |
Number of Logic Cells | 73008 | |
Number of Equivalent Gates | 876096 | |
Number of CLBs | 16224 | |
Combinatorial Delay of a CLB-Max | 420 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 16224 CLBS, 876096 GATES | |
Clock Frequency-Max | 400 MHz | |
Power Supplies | 1.2/3.6,1.8 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B1156 | |
Qualification Status | Not Qualified | |
Moisture Sensitivity Level | 1 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Number of Terminals | 1156 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1156,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, BGA1156,34X34,40 | |
Pin Count | 1156 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XCV3200E-7FG1156I Datasheet Download
XCV3200E-7FG1156I Overview
The XCV3200E-7FG1156I chip model is a powerful and versatile device that is suitable for a wide range of applications, including high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language, which is a powerful programming language that allows developers to create complex and highly efficient systems.
The XCV3200E-7FG1156I has several advantages over other chip models, such as its high speed, low power consumption, and low cost. It is also capable of handling large amounts of data quickly and accurately, making it an ideal choice for applications that require real-time processing. Furthermore, its design is highly efficient, making it an attractive option for developers who are looking to reduce system costs.
The demand for the XCV3200E-7FG1156I chip model is expected to continue to increase in the future, as more applications are developed that require its capabilities. It is likely to be used in a wide range of industries, such as automotive, medical, industrial, and consumer electronics. In addition, it is also likely to be used in networking and intelligent systems.
The XCV3200E-7FG1156I chip model is well-suited for applications in networks, as it is capable of handling large amounts of data quickly and accurately. It is also capable of operating in real-time, making it an ideal choice for applications that require real-time processing. Furthermore, its design is highly efficient, making it an attractive option for developers who are looking to reduce system costs.
In terms of intelligent applications, the XCV3200E-7FG1156I chip model is capable of handling complex tasks and can be used for a wide range of applications, such as facial recognition, gesture recognition, and voice recognition. It is also well-suited for use in the era of fully intelligent systems, as it is capable of performing complex tasks quickly and accurately.
In conclusion, the XCV3200E-7FG1156I chip model is a powerful and versatile device that is suitable for a wide range of applications, including high-performance digital signal processing, embedded processing, and image processing. It is capable of handling large amounts of data quickly and accurately, making it an ideal choice for applications that require real-time processing. Furthermore, its design is highly efficient, making it an attractive option for developers who are looking to reduce system costs. It is also well-suited for use in networks and intelligent systems, making it an ideal choice for applications in the era of fully intelligent systems.
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