XCV3200E-7FG1156I
XCV3200E-7FG1156I
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rohs

AMD Xilinx

XCV3200E-7FG1156I


XCV3200E-7FG1156I
F20-XCV3200E-7FG1156I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA, BGA1156,34X34,40
BGA, BGA1156,34X34,40

XCV3200E-7FG1156I ECAD Model


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XCV3200E-7FG1156I Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 804
Number of Outputs 804
Number of Logic Cells 73008
Number of Equivalent Gates 876096
Number of CLBs 16224
Combinatorial Delay of a CLB-Max 420 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Organization 16224 CLBS, 876096 GATES
Clock Frequency-Max 400 MHz
Power Supplies 1.2/3.6,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B1156
Qualification Status Not Qualified
Moisture Sensitivity Level 1
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Number of Terminals 1156
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1156,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA, BGA1156,34X34,40
Pin Count 1156
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XCV3200E-7FG1156I Datasheet Download


XCV3200E-7FG1156I Overview



The XCV3200E-7FG1156I chip model is a powerful and versatile device that is suitable for a wide range of applications, including high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language, which is a powerful programming language that allows developers to create complex and highly efficient systems.


The XCV3200E-7FG1156I has several advantages over other chip models, such as its high speed, low power consumption, and low cost. It is also capable of handling large amounts of data quickly and accurately, making it an ideal choice for applications that require real-time processing. Furthermore, its design is highly efficient, making it an attractive option for developers who are looking to reduce system costs.


The demand for the XCV3200E-7FG1156I chip model is expected to continue to increase in the future, as more applications are developed that require its capabilities. It is likely to be used in a wide range of industries, such as automotive, medical, industrial, and consumer electronics. In addition, it is also likely to be used in networking and intelligent systems.


The XCV3200E-7FG1156I chip model is well-suited for applications in networks, as it is capable of handling large amounts of data quickly and accurately. It is also capable of operating in real-time, making it an ideal choice for applications that require real-time processing. Furthermore, its design is highly efficient, making it an attractive option for developers who are looking to reduce system costs.


In terms of intelligent applications, the XCV3200E-7FG1156I chip model is capable of handling complex tasks and can be used for a wide range of applications, such as facial recognition, gesture recognition, and voice recognition. It is also well-suited for use in the era of fully intelligent systems, as it is capable of performing complex tasks quickly and accurately.


In conclusion, the XCV3200E-7FG1156I chip model is a powerful and versatile device that is suitable for a wide range of applications, including high-performance digital signal processing, embedded processing, and image processing. It is capable of handling large amounts of data quickly and accurately, making it an ideal choice for applications that require real-time processing. Furthermore, its design is highly efficient, making it an attractive option for developers who are looking to reduce system costs. It is also well-suited for use in networks and intelligent systems, making it an ideal choice for applications in the era of fully intelligent systems.



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