AMD Xilinx
XCV3200E-7FG1156C
XCV3200E-7FG1156C ECAD Model
XCV3200E-7FG1156C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 804 | |
| Number of Outputs | 804 | |
| Number of Logic Cells | 73008 | |
| Number of Equivalent Gates | 876096 | |
| Number of CLBs | 16224 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 16224 CLBS, 876096 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B1156 | |
| Qualification Status | Not Qualified | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1156,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA1156,34X34,40 | |
| Pin Count | 1156 |
XCV3200E-7FG1156C Datasheet Download
XCV3200E-7FG1156C Overview
The XCV3200E-7FG1156C chip model is a powerful and versatile tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used in conjunction with HDL language, making it the perfect choice for complex and sophisticated projects.
This chip model is a great choice for any industry that needs high-performance computing and processing capabilities. It is designed to be used in a wide range of applications, from automotive and aerospace systems to medical and consumer electronics. It can be used for both small-scale and large-scale projects, and its flexibility makes it an ideal choice for many different types of projects.
The XCV3200E-7FG1156C chip model has several advantages that make it an attractive choice for many industries. It is highly efficient, allowing for faster processing times while consuming less power. It also has a wide range of features, including a high-speed, low-power processor core, a wide variety of I/O interfaces, and an on-chip memory controller. Additionally, it is highly customizable, allowing users to tailor the chip to their specific needs.
The XCV3200E-7FG1156C chip model is expected to be in high demand in the future, as the need for high-performance, low-power computing solutions continues to grow. In order to meet the demands of the future, the chip model will need to be supported by new technologies. This could include support for new programming languages, new memory technologies, and new I/O interfaces. Additionally, the chip model will need to be able to keep up with the latest industry trends, such as the rise of artificial intelligence and the Internet of Things.
Overall, the XCV3200E-7FG1156C chip model is an excellent choice for any industry that needs high-performance, low-power computing solutions. Its flexibility, efficiency, and wide range of features make it an ideal choice for a variety of applications. As the need for high-performance computing solutions continues to grow, the chip model will need to be supported by new technologies, and it will need to keep up with the latest industry trends.
You May Also Be Interested In
5,604 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||