
AMD Xilinx
XCV3200E-6FG1156I
XCV3200E-6FG1156I ECAD Model
XCV3200E-6FG1156I Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Inputs | 804 | |
Number of Outputs | 804 | |
Number of Logic Cells | 73008 | |
Number of Equivalent Gates | 876096 | |
Number of CLBs | 16224 | |
Combinatorial Delay of a CLB-Max | 470 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 16224 CLBS, 876096 GATES | |
Clock Frequency-Max | 357 MHz | |
Power Supplies | 1.2/3.6,1.8 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B1156 | |
Qualification Status | Not Qualified | |
Moisture Sensitivity Level | 1 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Number of Terminals | 1156 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1156,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, BGA1156,34X34,40 | |
Pin Count | 1156 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XCV3200E-6FG1156I Datasheet Download
XCV3200E-6FG1156I Overview
The chip model XCV3200E-6FG1156I is a cutting-edge piece of technology that has been designed to provide advanced capabilities in the areas of network and intelligent system applications. It is a high-performance, low-power, multi-core processor that is suitable for use in a variety of applications, ranging from embedded systems to servers.
The chip model XCV3200E-6FG1156I is designed with a wide range of features and capabilities, making it suitable for use in a variety of applications. It is built to be highly efficient in terms of power consumption and performance, and is capable of handling multiple tasks simultaneously. It also has a high level of security, with support for encryption and authentication protocols, as well as other security measures.
The chip model XCV3200E-6FG1156I is also designed to be compatible with a number of industry standards, including Ethernet, Wi-Fi, Bluetooth, and USB. This allows it to be used in a wide range of applications and environments, making it a versatile and reliable choice for many applications.
In terms of industry trends, the chip model XCV3200E-6FG1156I is likely to be used in a variety of contexts, including in the development of intelligent systems and networks. As the technology continues to evolve, the chip model XCV3200E-6FG1156I is likely to become increasingly important in the development of intelligent systems and networks. It is also likely to become increasingly important in the development of the Internet of Things (IoT), as the chip model XCV3200E-6FG1156I is capable of handling the data processing and communication needs of IoT devices.
When it comes to the product description and design requirements of the chip model XCV3200E-6FG1156I, it is important to consider the specific needs of the application. The chip model XCV3200E-6FG1156I is designed to be highly efficient, with a low power consumption and a high level of performance. It is also designed to be compatible with a number of industry standards, making it suitable for use in a variety of applications and environments.
In terms of actual case studies and precautions, it is important to take into account the specific needs of the application when designing the chip model XCV3200E-6FG1156I. This is because the chip model XCV3200E-6FG1156I is designed to be highly efficient and reliable, and it is important to ensure that it is used in the correct manner. It is also important to consider the potential risks associated with the use of the chip model XCV3200E-6FG1156I, such as security vulnerabilities and the potential for data corruption.
Overall, the chip model XCV3200E-6FG1156I is a cutting-edge piece of technology that is designed to provide advanced capabilities in the areas of network and intelligent system applications. It is designed to be highly efficient, with a low power consumption and a high level of performance, and is capable of handling multiple tasks simultaneously. It is also designed to be compatible with a number of industry standards, making it suitable for use in a variety of applications and environments. It is also likely to become increasingly important in the development of intelligent systems and networks, as well as in the development of the Internet of Things (IoT). Finally, it is important to take into account the specific needs of the application when designing the chip model XCV3200E-6FG1156I, as well as the potential risks associated with its use.
You May Also Be Interested In
1,263 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
No reference price found. |