AMD Xilinx
XCV3200E-6FG1156C
XCV3200E-6FG1156C ECAD Model
XCV3200E-6FG1156C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 804 | |
| Number of Outputs | 804 | |
| Number of Logic Cells | 73008 | |
| Number of Equivalent Gates | 876096 | |
| Number of CLBs | 16224 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 16224 CLBS, 876096 GATES | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B1156 | |
| Qualification Status | Not Qualified | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 1156 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1156,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA1156,34X34,40 | |
| Pin Count | 1156 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCV3200E-6FG1156C Datasheet Download
XCV3200E-6FG1156C Overview
The Xilinx XCV3200E-6FG1156C chip model is a cutting-edge technology that is suitable for a wide range of applications, such as high-performance digital signal processing, embedded processing, and image processing. It is a powerful tool for engineers and developers to create complex and innovative projects. The chip model requires the use of HDL language for programming, which allows for the creation of powerful and efficient solutions.
The XCV3200E-6FG1156C chip model offers many advantages over conventional technologies, such as its high-speed processing capabilities, low power consumption, and scalability. With its high-performance capabilities, it can be used for a variety of applications, including those related to artificial intelligence, robotics, and autonomous systems. Its scalability also allows developers to use the same chip model for multiple projects, making it a cost-effective solution for large-scale projects.
The demand for the XCV3200E-6FG1156C chip model is expected to increase in the future, as more and more industries are relying on advanced technologies to increase their efficiency and productivity. The chip model can be applied to the development and popularization of future intelligent robots, as it is capable of providing the necessary processing power and scalability needed to power these robots. In order to use the XCV3200E-6FG1156C chip model effectively, technical expertise in HDL programming is necessary, as well as a deep understanding of the chip model's capabilities and limitations.
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3,516 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $21.2040 | $21.2040 |
| 10+ | $20.9760 | $209.7600 |
| 100+ | $19.8360 | $1,983.6000 |
| 1000+ | $18.6960 | $9,348.0000 |
| 10000+ | $17.1000 | $17,100.0000 |
| The price is for reference only, please refer to the actual quotation! | ||