AMD Xilinx
XCV300E-8PQG240I
XCV300E-8PQG240I ECAD Model
XCV300E-8PQG240I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 158 | |
| Number of Outputs | 158 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 82944 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 82944 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP240,1.3SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | FQFP, QFP240,1.3SQ,20 | |
| Pin Count | 240 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XCV300E-8PQG240I Datasheet Download
XCV300E-8PQG240I Overview
The XCV300E-8PQG240I chip model is a powerful and reliable solution for high-performance digital signal processing, embedded processing, and image processing. It is designed to be programmed using the HDL language, which is a hardware description language used to create integrated circuit designs. This chip model offers numerous potential applications in the realm of networks and intelligent systems.
The XCV300E-8PQG240I is a powerful and reliable chip model that can be used for a variety of applications. It is designed to be programmed using HDL, which is a hardware description language used to create integrated circuit designs. The chip model is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications. It has the ability to process data quickly and accurately, making it a great choice for applications that require real-time data processing.
The product description of the XCV300E-8PQG240I chip model states that it is an integrated circuit with a maximum power dissipation of 3.3W and a maximum operating temperature of 85°C. It is also equipped with an 8-bit microcontroller and a 16-bit multiplier. The chip model is capable of processing data at a high speed, making it suitable for applications that require real-time data processing.
The XCV300E-8PQG240I chip model can be used in a variety of applications, such as high-performance digital signal processing, embedded processing, image processing, and other applications that require real-time data processing. In addition, the chip model can be used in the era of fully intelligent systems, as it is capable of processing data quickly and accurately. It can be used in applications such as machine learning, AI, and robotics.
When using the XCV300E-8PQG240I chip model, it is important to consider the design requirements of the application. It is important to ensure that the chip model is able to meet the requirements of the application, such as the power dissipation, temperature, and other factors. Additionally, it is important to consider the actual case studies and precautions when using the chip model, as this will help to ensure that the application is successful.
In conclusion, the XCV300E-8PQG240I chip model is a powerful and reliable solution for high-performance digital signal processing, embedded processing, and image processing. It is designed to be programmed using the HDL language and is suitable for applications that require real-time data processing. It is also capable of being used in the era of fully intelligent systems, such as machine learning, AI, and robotics. When using the chip model, it is important to consider the design requirements of the application and the actual case studies and precautions.
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