AMD Xilinx
XCV300E-8PQG240C
XCV300E-8PQG240C ECAD Model
XCV300E-8PQG240C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 158 | |
| Number of Outputs | 158 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 82944 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 82944 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP240,1.3SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-240 | |
| Pin Count | 240 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XCV300E-8PQG240C Datasheet Download
XCV300E-8PQG240C Overview
The chip model XCV300E-8PQG240C is a powerful and versatile tool for high-performance digital signal processing, embedded processing, image processing, and more. It is designed with an HDL language which provides a reliable, efficient and easy-to-use platform for these applications.
The chip model XCV300E-8PQG240C is capable of meeting the needs of a wide range of industries. Its versatility and performance make it ideal for applications that require high-speed processing and accurate results. Additionally, its HDL language allows for easy integration with existing systems and hardware.
The chip model XCV300E-8PQG240C has several advantages over traditional chip models. It is capable of providing faster processing speeds and more accurate results. Additionally, its HDL language makes it easier to integrate with existing systems and hardware. This makes it an ideal choice for applications that require a high degree of accuracy and speed.
The demand for the chip model XCV300E-8PQG240C is expected to continue to increase in the future. As more industries begin to adopt new technologies, such as artificial intelligence and machine learning, the need for a reliable and efficient platform for digital signal processing, embedded processing, and image processing will continue to grow. The chip model XCV300E-8PQG240C is well-suited to meet these needs and is expected to remain a popular choice in the future.
The chip model XCV300E-8PQG240C is a powerful and versatile tool that can be used in a variety of industries. Its HDL language makes it easy to integrate with existing systems and hardware, while its performance and accuracy make it an ideal choice for applications that require high-speed processing and accurate results. The expected demand for the chip model XCV300E-8PQG240C is expected to continue to increase in the future, as more industries adopt new technologies and require reliable and efficient platforms for digital signal processing, embedded processing, and image processing.
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