
AMD Xilinx
XCV300E-8FGG456C
XCV300E-8FGG456C ECAD Model
XCV300E-8FGG456C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Inputs | 312 | |
Number of Outputs | 312 | |
Number of Logic Cells | 6912 | |
Number of Equivalent Gates | 82944 | |
Number of CLBs | 1536 | |
Combinatorial Delay of a CLB-Max | 400 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1536 CLBS, 82944 GATES | |
Clock Frequency-Max | 416 MHz | |
Power Supplies | 1.2/3.6,1.8 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B456 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 456 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA456,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 23 mm | |
Length | 23 mm | |
Seated Height-Max | 2.6 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | FBGA-456 | |
Pin Count | 456 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XCV300E-8FGG456C Datasheet Download
XCV300E-8FGG456C Overview
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2,392 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $139.5000 | $139.5000 |
10+ | $138.0000 | $1,380.0000 |
100+ | $130.5000 | $13,050.0000 |
1000+ | $123.0000 | $61,500.0000 |
10000+ | $112.5000 | $112,500.0000 |
The price is for reference only, please refer to the actual quotation! |