XCV300E-8FGG456C
XCV300E-8FGG456C
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rohs

AMD Xilinx

XCV300E-8FGG456C


XCV300E-8FGG456C
F20-XCV300E-8FGG456C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, FBGA-456
FBGA-456

XCV300E-8FGG456C ECAD Model


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XCV300E-8FGG456C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 312
Number of Outputs 312
Number of Logic Cells 6912
Number of Equivalent Gates 82944
Number of CLBs 1536
Combinatorial Delay of a CLB-Max 400 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 1536 CLBS, 82944 GATES
Clock Frequency-Max 416 MHz
Power Supplies 1.2/3.6,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B456
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 456
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA456,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 23 mm
Length 23 mm
Seated Height-Max 2.6 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description FBGA-456
Pin Count 456
Reach Compliance Code unknown
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XCV300E-8FGG456C Datasheet Download


XCV300E-8FGG456C Overview



The chip model XCV300E-8FGG456C is a revolutionary technology that has the potential to revolutionize the industry. It is a powerful, low-power, and high-performance chip that is designed to enable the development of a wide range of applications. It is an integrated circuit that can be used in a variety of applications such as networking, intelligent systems, and other applications.


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The chip model XCV300E-8FGG456C has the potential to be used in a variety of applications. It can be used in networks to enable the development of intelligent systems. It can also be used in the era of fully intelligent systems, allowing for the development of applications that require the support of new technologies.


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In terms of actual case studies and precautions, the chip model XCV300E-8FGG456C is designed to be highly efficient and reliable. It is designed to provide high-speed data processing and low-power operation. It also provides advanced security features and is highly scalable. It is designed to be compatible with a wide range of applications and can be used in a variety of environments.


In conclusion, the chip model XCV300E-8FGG456C is a revolutionary technology that has the potential to revolutionize the industry. It is designed to provide high-speed data processing and low-power operation. It is also designed to be highly scalable, allowing for the development of applications in a variety of environments. It is designed to be compatible with a wide range of applications and can be used in a variety of environments. It is also designed to provide advanced security features and is highly scalable. The chip model XCV300E-8FGG456C is an attractive option for a variety of applications and can be used in the era of fully intelligent systems.



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QTY Unit Price Ext Price
1+ $139.5000 $139.5000
10+ $138.0000 $1,380.0000
100+ $130.5000 $13,050.0000
1000+ $123.0000 $61,500.0000
10000+ $112.5000 $112,500.0000
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