XCV300E-8FG456C
XCV300E-8FG456C
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AMD Xilinx

XCV300E-8FG456C


XCV300E-8FG456C
F20-XCV300E-8FG456C
Active
IC FPGA 312 I/O 456FBGA
456-FBGA (23x23)

XCV300E-8FG456C ECAD Model


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XCV300E-8FG456C Attributes


Type Description Select
Mfr AMD Xilinx
Series Virtex®-E
Package Tray
Number of LABs/CLBs 1536
Number of Logic Elements/Cells 6912
Total RAM Bits 131072
Number of I/O 312
Number of Gates 411955
Voltage - Supply 1.71V ~ 1.89V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 456-BBGA
Supplier Device Package 456-FBGA (23x23)
Base Product Number XCV300E

XCV300E-8FG456C Datasheet Download


XCV300E-8FG456C Overview



The XCV300E-8FG456C chip is a mid-range field-programmable gate array (FPGA) from Xilinx. It is a member of the Virtex-E family of FPGAs, which provides high performance and low power consumption.


The XCV300E-8FG456C has a capacity of 8 million logic gates, with a maximum clock frequency of 300 MHz. It is built on a 0.18-micron process and has an operating voltage of 1.2 to 3.3V. It has a total of 805 I/Os, with up to 8 banks of I/Os, and offers up to 8 banks of dedicated high-speed SERDES (serializer/deserializer) I/Os. It also has support for up to 4 DDR2 memory controllers with up to 32-bit data width.


The XCV300E-8FG456C is suitable for a wide range of applications, including wired and wireless communications, storage and data processing, imaging, medical, automotive and industrial control. Its low power consumption and high performance make it ideal for applications that require high data throughput and low latency.


The XCV300E-8FG456C is available in a range of packages, including a VFBGA (very fine-pitch ball grid array) and a PQFP (plastic quad flat package). It is also available with a variety of development boards, which provide a platform for rapid prototyping and development.



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QTY Unit Price Ext Price
1+ $139.5000 $139.5000
10+ $138.0000 $1,380.0000
100+ $130.5000 $13,050.0000
1000+ $123.0000 $61,500.0000
10000+ $112.5000 $112,500.0000
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