AMD Xilinx
XCV300E-8BGG432C
XCV300E-8BGG432C ECAD Model
XCV300E-8BGG432C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 316 | |
| Number of Outputs | 316 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 82944 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 82944 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B432 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 432 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA432,31X31,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-432 | |
| Pin Count | 432 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XCV300E-8BGG432C Datasheet Download
XCV300E-8BGG432C Overview
XCV300E-8BGG432C is an advanced chip model that is designed for high-performance digital signal processing, embedded processing, and image processing. It is a powerful and efficient chip model that can be used in a wide range of applications.
The XCV300E-8BGG432C is based on a 32-bit RISC processor, and it is capable of running high-performance algorithms. It also features a high-speed memory interface and a wide range of peripherals. The chip also has a low power consumption and a high clock frequency, making it an ideal choice for applications that require high performance.
The XCV300E-8BGG432C is designed to be used with the HDL language, which is a hardware description language that is used to design and program the chip. This language is used to create the logic and data structures that are used to control the chip. It is also used to create the algorithms that are used to process data.
The XCV300E-8BGG432C is a powerful chip model that has several advantages over other chip models. It is capable of running high-performance algorithms and can be used in a wide range of applications. It also has a low power consumption and a high clock frequency, making it an ideal choice for applications that require high performance. In addition, the chip is designed to be used with the HDL language, which is a hardware description language that is used to design and program the chip.
The demand for the XCV300E-8BGG432C is expected to increase in the future, as it is an ideal choice for applications that require high performance. The chip is also designed to be used with the HDL language, which is a hardware description language that is used to design and program the chip. This language is used to create the logic and data structures that are used to control the chip, and it is also used to create the algorithms that are used to process data.
When designing with the XCV300E-8BGG432C, it is important to pay attention to the product description and design requirements. It is also important to consider the actual case studies and precautions when using the chip. For example, the chip is designed to be used with the HDL language, and it is important to understand the language and the design requirements in order to use the chip correctly. Additionally, it is important to understand the power consumption and clock frequency requirements of the chip in order to ensure that the chip is used correctly and efficiently.
In conclusion, the XCV300E-8BGG432C is an advanced chip model that is designed for high-performance digital signal processing, embedded processing, and image processing. It is a powerful and efficient chip model that has several advantages over other chip models. The demand for the chip is expected to increase in the future, and it is important to understand the product description and design requirements, as well as the actual case studies and precautions when using the chip.
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