XCV300E-8BGG352C
XCV300E-8BGG352C
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rohs

AMD Xilinx

XCV300E-8BGG352C


XCV300E-8BGG352C
F20-XCV300E-8BGG352C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, LBGA
LBGA

XCV300E-8BGG352C ECAD Model


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XCV300E-8BGG352C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Equivalent Gates 82944
Number of CLBs 1536
Combinatorial Delay of a CLB-Max 400 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 1536 CLBS, 82944 GATES
Clock Frequency-Max 416 MHz
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B352
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 352
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 1.7 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description LBGA,
Pin Count 352
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01

XCV300E-8BGG352C Datasheet Download


XCV300E-8BGG352C Overview



The XCV300E-8BGG352C chip model is a powerful and versatile model that can be used for a variety of applications. It is highly suitable for high-performance digital signal processing, embedded processing, and image processing. It is also compatible with the HDL (Hardware Description Language) language, making it an ideal choice for developing complex systems.


The XCV300E-8BGG352C chip model has several advantages that make it an attractive choice for a wide range of applications. It is extremely energy-efficient, making it ideal for applications that require low power consumption. It also has a high clock speed and large storage capacity, making it suitable for high-performance applications. Furthermore, the chip model has a wide range of features, such as advanced memory protection and error checking, which make it reliable and secure.


The demand for the XCV300E-8BGG352C chip model is expected to increase in the future, particularly in the fields of embedded systems, robotics, and artificial intelligence. The chip model is well-suited for the development of intelligent robots, as it has the necessary features and capabilities to support the development of advanced algorithms and systems. Furthermore, the XCV300E-8BGG352C chip model is highly customizable, allowing users to tailor the hardware to their specific requirements.


To use the XCV300E-8BGG352C chip model effectively, it is important to have a strong understanding of the HDL language and the chip model’s features. It is also necessary to have a good grasp of the underlying architecture and the available features. Furthermore, knowledge of the chip model’s memory protection and error checking features is essential to ensure the security and reliability of the system. With the right knowledge and skills, the XCV300E-8BGG352C chip model can be used to develop and popularize future intelligent robots.



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