
AMD Xilinx
XCV300E-8BGG352C
XCV300E-8BGG352C ECAD Model
XCV300E-8BGG352C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Equivalent Gates | 82944 | |
Number of CLBs | 1536 | |
Combinatorial Delay of a CLB-Max | 400 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1536 CLBS, 82944 GATES | |
Clock Frequency-Max | 416 MHz | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B352 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 352 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 1.7 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | LBGA, | |
Pin Count | 352 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 |
XCV300E-8BGG352C Datasheet Download
XCV300E-8BGG352C Overview
The XCV300E-8BGG352C chip model is a powerful and versatile model that can be used for a variety of applications. It is highly suitable for high-performance digital signal processing, embedded processing, and image processing. It is also compatible with the HDL (Hardware Description Language) language, making it an ideal choice for developing complex systems.
The XCV300E-8BGG352C chip model has several advantages that make it an attractive choice for a wide range of applications. It is extremely energy-efficient, making it ideal for applications that require low power consumption. It also has a high clock speed and large storage capacity, making it suitable for high-performance applications. Furthermore, the chip model has a wide range of features, such as advanced memory protection and error checking, which make it reliable and secure.
The demand for the XCV300E-8BGG352C chip model is expected to increase in the future, particularly in the fields of embedded systems, robotics, and artificial intelligence. The chip model is well-suited for the development of intelligent robots, as it has the necessary features and capabilities to support the development of advanced algorithms and systems. Furthermore, the XCV300E-8BGG352C chip model is highly customizable, allowing users to tailor the hardware to their specific requirements.
To use the XCV300E-8BGG352C chip model effectively, it is important to have a strong understanding of the HDL language and the chip model’s features. It is also necessary to have a good grasp of the underlying architecture and the available features. Furthermore, knowledge of the chip model’s memory protection and error checking features is essential to ensure the security and reliability of the system. With the right knowledge and skills, the XCV300E-8BGG352C chip model can be used to develop and popularize future intelligent robots.
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