AMD Xilinx
XCV300E-8BG432I
XCV300E-8BG432I ECAD Model
XCV300E-8BG432I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 316 | |
| Number of Outputs | 316 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 82944 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 82944 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B432 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 432 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA432,31X31,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-432 | |
| Pin Count | 432 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCV300E-8BG432I Datasheet Download
XCV300E-8BG432I Overview
The XCV300E-8BG432I chip model is a powerful and versatile digital signal processor (DSP) designed for high-performance applications. Its features make it an ideal choice for a range of applications, including embedded processing, image processing, and digital signal processing. It also requires the use of HDL language for programming.
The XCV300E-8BG432I chip model can be used in many different scenarios, such as networks and intelligent systems. It can be used to develop and popularize future intelligent robots, as it has the capability to process data quickly and accurately. To use the model effectively, one must possess technical knowledge and experience in HDL language and digital signal processing.
In the era of fully intelligent systems, the XCV300E-8BG432I chip model can be used to create powerful and sophisticated robots. It can be used to create robots with advanced artificial intelligence (AI) capabilities, as well as robots that can perform complex tasks. It can also be used to create robots that can interact with humans in natural language.
The XCV300E-8BG432I chip model is an excellent choice for those looking to create powerful and sophisticated robots. It is a powerful and versatile digital signal processor that can be used to create robots with advanced AI capabilities. To use the model effectively, one must possess technical knowledge and experience in HDL language and digital signal processing. With the right technical talents, the XCV300E-8BG432I chip model can be used to create powerful and sophisticated robots for the era of fully intelligent systems.
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1,806 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $363.5174 | $363.5174 |
| 10+ | $359.6086 | $3,596.0859 |
| 100+ | $340.0646 | $34,006.4643 |
| 1000+ | $320.5207 | $160,260.3490 |
| 10000+ | $293.1592 | $293,159.1750 |
| The price is for reference only, please refer to the actual quotation! | ||