AMD Xilinx
XCV300E-8BG352I
XCV300E-8BG352I ECAD Model
XCV300E-8BG352I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 260 | |
| Number of Outputs | 260 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 82944 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 400 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 82944 GATES | |
| Clock Frequency-Max | 416 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B352 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA352,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-352 | |
| Pin Count | 352 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XCV300E-8BG352I Datasheet Download
XCV300E-8BG352I Overview
The XCV300E-8BG352I chip model is a high-performance digital signal processor, embedded processor, and image processor that is designed to meet the needs of modern digital signal processing. This chip model is designed to be used with the HDL language, which is a high-level language for designing digital systems. This language is designed to make it easier for developers to design complex digital systems.
The XCV300E-8BG352I chip model has several advantages that make it attractive to developers. It is designed to be highly efficient, meaning that it can process data faster than other chips. Additionally, it is designed to be more reliable, meaning that it can handle more data without crashing or having other issues. Finally, it is designed to be cost-effective, meaning that it can be used in a variety of applications without breaking the bank.
The XCV300E-8BG352I chip model is expected to be in high demand in the near future. This is due to the fact that it is a high-performance chip that is designed for a variety of applications. Additionally, it is designed to be used in a wide range of industries, from automotive to medical. As more industries adopt digital signal processing and embedded processing, the demand for this chip model is expected to increase.
The application environment for the XCV300E-8BG352I chip model may require the support of new technologies. This is due to the fact that digital signal processing and embedded processing are becoming increasingly complex. As a result, developers may need to use new technologies in order to get the most out of their applications. Additionally, new technologies may be needed to ensure that the chip model is able to keep up with the ever-evolving industry trends.
Overall, the XCV300E-8BG352I chip model is a high-performance digital signal processor, embedded processor, and image processor that is designed to meet the needs of modern digital signal processing. It is expected to be in high demand in the near future due to its efficiency, reliability, and cost-effectiveness. Additionally, the application environment for the chip model may require the support of new technologies in order to keep up with the ever-evolving industry trends.
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