AMD Xilinx
XCV300E-7PQG240I
XCV300E-7PQG240I ECAD Model
XCV300E-7PQG240I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 158 | |
| Number of Outputs | 158 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 82944 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 82944 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP240,1.3SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-240 | |
| Pin Count | 240 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XCV300E-7PQG240I Datasheet Download
XCV300E-7PQG240I Overview
The XCV300E-7PQG240I chip model is an advanced integrated circuit (IC) designed for high-performance digital signal processing, embedded processing, and image processing. It is designed to provide a powerful combination of features and performance, while still being cost-effective. The chip model is based on a Virtex-7 FPGA architecture and is programmed using hardware description language (HDL) such as Verilog or VHDL.
The XCV300E-7PQG240I chip model offers a wide range of advantages over other competing models. It has a high-speed transceiver, which enables faster data transfer and higher resolution images. It also has a large number of configurable I/O pins, allowing for more flexible system designs. The chip model also features advanced power management features, allowing for more efficient power consumption.
The XCV300E-7PQG240I chip model is expected to see increasing demand in the coming years due to its advanced features and performance. Its ability to handle high-performance digital signal processing, embedded processing, and image processing makes it suitable for use in a variety of industries. Its cost-effectiveness also makes it attractive to cost-conscious customers.
The original design intention of the XCV300E-7PQG240I chip model was to provide a powerful combination of features and performance, while still being cost-effective. The chip model is designed to be upgradable, allowing for future improvements and upgrades. This makes it suitable for use in advanced communication systems, as well as for applications that require more advanced features.
Overall, the XCV300E-7PQG240I chip model is an advanced integrated circuit designed for high-performance digital signal processing, embedded processing, and image processing. It is designed to provide a powerful combination of features and performance, while still being cost-effective. Its upgradability and ability to handle advanced communication systems also make it suitable for a wide range of applications. Its expected demand in the coming years makes it an attractive option for cost-conscious customers.
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