AMD Xilinx
XCV300E-7PQG240C
XCV300E-7PQG240C ECAD Model
XCV300E-7PQG240C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 158 | |
| Number of Outputs | 158 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 82944 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 82944 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PQFP-G240 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 240 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP240,1.3SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 32 mm | |
| Length | 32 mm | |
| Seated Height-Max | 4.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | QFP | |
| Package Description | PLASTIC, QFP-240 | |
| Pin Count | 240 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
XCV300E-7PQG240C Datasheet Download
XCV300E-7PQG240C Overview
The chip model XCV300E-7PQG240C is a powerful and versatile device designed for a variety of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. This chip is a great choice for those who need a reliable, high-performance device.
The industry trends of the chip model XCV300E-7PQG240C and the future development of related industries depend on what specific technologies are needed. This chip is designed to be flexible and be able to handle a variety of applications. As technology advances, the chip can be upgraded to meet the needs of new technologies.
The original design intention of the chip model XCV300E-7PQG240C was to provide a reliable, high-performance device for a variety of applications. The chip is designed to be flexible and can be upgraded to meet the needs of new technologies and applications. It is also possible to use the chip in advanced communication systems.
In conclusion, the chip model XCV300E-7PQG240C is a powerful and versatile device suitable for a variety of applications. It is designed to be flexible and can be upgraded to meet the needs of new technologies and applications. It is also possible to use the chip in advanced communication systems.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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