AMD Xilinx
XCV300E-7FGG456I
XCV300E-7FGG456I ECAD Model
XCV300E-7FGG456I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 312 | |
| Number of Outputs | 312 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 82944 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 82944 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-456 | |
| Pin Count | 456 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XCV300E-7FGG456I Datasheet Download
XCV300E-7FGG456I Overview
The XCV300E-7FGG456I chip model is a powerful and versatile processor that is suitable for a range of applications, including high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, allowing users to easily create and modify their own designs.
This chip model is designed to be highly flexible and upgradeable, giving users the ability to make changes and improvements to their designs as needed. It is also capable of being used in advanced communication systems, as it has the necessary features to handle the complexity of such systems.
The XCV300E-7FGG456I chip model can also be used in the development and popularization of future intelligent robots. Its powerful processing capabilities and flexible design make it an ideal choice for creating robots that can perform complex tasks. It can also be used to create robots that can interact with their environment in a more natural way.
Using the XCV300E-7FGG456I chip model effectively requires a certain level of technical knowledge. Those who are familiar with the HDL language will be able to make the most of its features and capabilities. Additionally, those with experience in robotics and artificial intelligence will be able to use the chip model to create sophisticated robots.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||