AMD Xilinx
XCV300E-7FGG456C
XCV300E-7FGG456C ECAD Model
XCV300E-7FGG456C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 312 | |
| Number of Outputs | 312 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 82944 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 82944 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B456 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 456 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 23 mm | |
| Length | 23 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-456 | |
| Pin Count | 456 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XCV300E-7FGG456C Datasheet Download
XCV300E-7FGG456C Overview
The XCV300E-7FGG456C chip model is a powerful microprocessor that is suitable for a variety of applications, such as high-performance digital signal processing, embedded processing, and image processing. It is also capable of using HDL language, making it an ideal choice for engineers and developers in the field of digital hardware design.
The potential applications of the XCV300E-7FGG456C in networks and intelligent scenarios are vast. With its powerful processing capabilities, it could be used to develop next-generation intelligent systems and robots. In the era of fully intelligent systems, the XCV300E-7FGG456C chip model can be used to create smarter robots that can sense, analyze, and act on their environment. This could be used in a variety of applications, such as healthcare, home automation, and transportation.
In order to use the XCV300E-7FGG456C chip model effectively, engineers and developers need to have a good understanding of digital hardware design, HDL language, and robotics. They also need to have a good understanding of the principles of robotics, including kinematics, dynamics, and control. With the right knowledge and skills, engineers and developers can create powerful and reliable robots that can be used in a variety of scenarios.
In conclusion, the XCV300E-7FGG456C chip model is an ideal choice for engineers and developers who want to develop next-generation intelligent systems and robots. With its powerful processing capabilities and the ability to use HDL language, it can be used to create smarter robots that can sense, analyze, and act on their environment. In order to use the XCV300E-7FGG456C chip model effectively, engineers and developers need to have a good understanding of digital hardware design, HDL language, and robotics.
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1,343 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $52.0800 | $52.0800 |
| 10+ | $51.5200 | $515.2000 |
| 100+ | $48.7200 | $4,872.0000 |
| 1000+ | $45.9200 | $22,960.0000 |
| 10000+ | $42.0000 | $42,000.0000 |
| The price is for reference only, please refer to the actual quotation! | ||