AMD Xilinx
XCV300E-7BGG432I
XCV300E-7BGG432I ECAD Model
XCV300E-7BGG432I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 316 | |
| Number of Outputs | 316 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 82944 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 82944 GATES | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B432 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 432 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA432,31X31,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 1.7 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA-432 | |
| Pin Count | 432 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XCV300E-7BGG432I Datasheet Download
XCV300E-7BGG432I Overview
The XCV300E-7BGG432I chip model is a powerful and versatile solution for a variety of digital signal processing, embedded processing, and image processing applications. This model is designed to be used with the HDL language, making it an ideal choice for engineers looking to maximize processing performance and efficiency.
The XCV300E-7BGG432I chip model offers several advantages over other models in its class. It is capable of handling a large number of simultaneous tasks, making it an ideal choice for embedded applications. It also provides very low power consumption, reducing the cost of operation and increasing efficiency. The chip model also supports a wide range of peripherals, allowing for a more flexible design.
The XCV300E-7BGG432I chip model is expected to become increasingly popular in the coming years. This is due to the fact that it is capable of handling a wide range of tasks, making it suitable for a variety of applications. It is also able to provide a high level of performance and efficiency, making it an attractive choice for engineers.
When designing with the XCV300E-7BGG432I chip model, it is important to consider the specific requirements of the application. This includes the type of peripherals that are required, the size of the board, and the type of communication protocols that need to be supported. Additionally, it is important to consider the power requirements of the application, as this will affect the overall performance of the chip.
In order to ensure successful design and implementation of the XCV300E-7BGG432I chip model, it is important to consider actual case studies and precautions. This includes considering the power requirements of the application, as well as the types of peripherals that need to be supported. Additionally, it is important to ensure that the board size is suitable for the application and that the communication protocols are compatible with the chip model.
Overall, the XCV300E-7BGG432I chip model is an ideal solution for a variety of digital signal processing, embedded processing, and image processing applications. Its low power consumption and wide range of peripherals make it an attractive choice for engineers looking to maximize performance and efficiency. With careful consideration of the application requirements and actual case studies, this chip model can be successfully implemented for many applications.
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